Embedded Package-Substrate Inductors for Compact Power Delivery
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Solution Overview
Problem
Traditional inductors are bulky and cannot be embedded in semiconductor substrates, leading to large form factors that are unsuitable for mobile and wearable computing devices, where smaller, high-performance inductors with efficient power delivery are required.
Innovation Solution
The integration of prefabricated inductors within the AC/DC substrate using a method that involves routing trenches in a substrate core, depositing conductive and magnetic materials, and forming via holes to create an inductive pattern, allowing for embedded inductors that can be closer to dies and provide superior vertical power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional inductors are used externally mounted on PCB, then inductor functionality is achieved, but device form factor becomes too large and thick for mobile and wearable devices
Solution Approach 1:
The patent merges the inductor with the package substrate by embedding the inductor structure within the substrate layers. The inductor windings are formed using conductive material deposited on external surfaces of the substrate, integrating the inductor as part of the substrate structure rather than a separate external component. This merging reduces the overall device form factor while maintaining power delivery efficiency through the integrated design.
Solution Approach 2:
The patent transitions from traditional planar PCB mounting to three-dimensional embedding within the substrate. The inductor is formed by depositing conductive material on external surfaces and creating windings that extend through multiple layers of the substrate, utilizing the vertical dimension and internal substrate volume. This dimensional change enables compact integration while maintaining inductor performance.
2Area of stationary object
If inductors are embedded in substrate, then device form factor is reduced, but manufacturing complexity increases due to fine-pitch routing requirements
Solution Approach 1:
The patent makes the package substrate serve multiple functions: it provides mechanical support for the die, enables electrical interconnection through fine-pitch routing, and hosts the embedded inductor structure. The external surfaces of the substrate are utilized both for die attachment and for forming the inductor windings, creating a multi-functional structure that reduces overall device complexity despite the embedded inductor integration.
3Loss of energy
If inductors are placed closer to dies, then power delivery efficiency improves, but substrate area available for routing is reduced
Solution Approach 1:
The patent utilizes the external surfaces and vertical dimension of the substrate to form the inductor windings, rather than confining the inductor to the planar substrate interior. This allows the inductor to be positioned close to the die for efficient power delivery while the windings extend vertically and externally, preserving horizontal substrate area for fine-pitch routing and interconnects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables smaller, high-performance inductors that reduce power losses and meet the form factor requirements of mobile and wearable devices, while maintaining performance comparable to prior art techniques.
Implementation Method 1
depositing a conductive material in the plurality of trenches in the substrate core; depositing a magnetic material on a first surface of the substrate core and a first surface of the conductive material deposited in the plurality of trenches in the substrate core
Data Source
AI summary
A semiconductor package substrate with embedded passive devices and methods of forming the same is provided. Embedded passive devices include inductors and inductor modules and methods of forming the same are provided. Embedded inductors may be formed by deposition of magnetic core material, trenching of one or more channels, and placement of conductive wires to form an module embeddable in the semiconductor package substrate core. Provided are methods and apparatus for formation of embeddable pot-core, toroidal, and helical inductors.