Embedded Substrate Insulating Member Thermal Stress
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Solution Overview
Problem
The division of a lower electrode in electronic components to achieve low equivalent series inductance results in reduced strength, making the components susceptible to damage during handling.
Innovation Solution
An electronic component embedded substrate with an insulating layer and embedded electronic components, where at least some second terminals are embedded in the insulating layer, and an insulating member with a different thermal expansion coefficient is placed between neighboring second terminals to inhibit strength reduction and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the lower electrode is divided into a plurality of parts to achieve low equivalent series inductance, then the equivalent series inductance is reduced, but the strength of the electronic component is lowered
Solution Approach 1:
An insulating member is introduced as an intermediary element between the divided lower electrode parts (second terminals). This insulating member has a thermal expansion coefficient different from both the insulating layer and the electrode material, acting as a buffer to reduce stress concentration at the divided electrode interfaces, thereby preventing damage while maintaining the low-ESL structure
Solution Approach 2:
The patent changes the thermal expansion coefficient parameter of the insulating member to be between that of the insulating layer and the electrode material. This parameter selection creates a gradient that gradually transitions thermal stress, preventing sudden stress concentration that would damage the divided electrode structure
2Strength
If an insulating member with different thermal expansion coefficient is provided between neighboring second terminals, then stress from thermal expansion difference is relaxed, but the device complexity increases
Solution Approach 1:
The insulating member is applied locally only at critical positions between divided electrode terminals rather than throughout the entire structure. This localized application provides stress relaxation exactly where needed at the electrode interfaces while minimizing overall structural complexity and material usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of damage to the electronic components by mitigating stress and preventing short circuits, while enhancing the overall strength of the substrate.
Implementation Method 1
the insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other
Data Source
AI summary
An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.