Embedded Substrate With Intersecting Through Holes

The patent transitions from two-dimensional surface mounting to three-dimensional embedding by creating through portions that penetrate the substrate. Electronic components are placed within these through portions and connected via conductive materials, enabling vertical stacking and multi-layer integration. This dimensional change allows significantly more components to be mounted on the same substrate area while maintaining structural organization through the layered insulating and conductive material arrangement.

The patent applies local quality by providing insulating materials selectively at specific locations where needed - namely, covering the electronic components disposed in the through portions. This localized insulation approach allows direct electrical connections between components through conductive materials while providing necessary isolation only where components are present, rather than requiring comprehensive insulation throughout the entire substrate structure.

The patent segments the substrate into distinct functional layers: insulating layers forming the base structure, through portions creating embedded cavities, electronic components placed within through portions, and insulating materials covering components. This segmentation allows each element to be optimized independently while maintaining overall structural coherence, enabling higher component density without proportionally increasing overall complexity.