Embedded Component Substrate With Laser-Created Cavity
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Solution Overview
Problem
The increasing number of components on smartphone mainboards, particularly with the advent of 5G technology, requires a reduction in component size while maintaining compatibility with 4G and LTE communications, necessitating innovative substrate designs for efficient mounting and processing of electronic components.
Innovation Solution
A substrate with embedded electronic components featuring a core substrate with multiple wiring layers, insulating layers, and a stopper layer within a cavity, where the stopper layer protrudes on the bottom surface and is surrounded by a groove, utilizing a laser process for cavity formation to enhance productivity and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of components on the mainboard is increased to support 5G technology, then the functionality and communication capability are improved, but the component size and substrate area required increase
Solution Approach 1:
The electronic component is embedded within a cavity formed in the core substrate, allowing the component to be nested inside the substrate structure rather than mounted on the surface. This nesting approach reduces the overall footprint and allows more components to be integrated into the same substrate area, resolving the contradiction between increased functionality and substrate area requirements
Solution Approach 2:
The invention transitions from two-dimensional surface mounting to three-dimensional embedding by creating a cavity within the substrate thickness direction. The component is positioned within this cavity at a different depth level, utilizing the vertical dimension to reduce horizontal space occupation, thereby accommodating more components without increasing substrate area
2Volume of moving object
If a cavity process is used to embed electronic components, then the component size is reduced and integration is improved, but the manufacturing complexity and processing difficulty increase
Solution Approach 1:
The mechanical drilling or milling process for cavity formation is replaced with a laser processing method. The laser beam precisely ablates the substrate material to create the cavity, eliminating the need for complex mechanical tooling and reducing manufacturing steps. This substitution significantly simplifies the cavity formation process while maintaining precision, resolving the contradiction between component integration and manufacturing ease
Solution Approach 2:
The invention changes the processing parameters by using laser energy density and pulse duration control to precisely form the cavity. By adjusting laser parameters such as power, speed, and focal position, the cavity can be created with exact dimensions required for component embedding, simplifying the overall manufacturing process while achieving the desired component size reduction
3Reliability
If the cavity process is performed using traditional mechanical methods, then the structure is formed, but the productivity is reduced due to lengthy processing time
Solution Approach 1:
Traditional mechanical drilling or milling methods are replaced with laser processing, which removes material through thermal ablation rather than mechanical contact. This non-contact process is significantly faster than mechanical methods while maintaining or improving cavity precision, thereby resolving the contradiction between structural reliability and processing speed by eliminating the slow mechanical removal process
Solution Approach 2:
The laser processing employs pulsed laser delivery rather than continuous irradiation, allowing rapid sequential pulses to remove material efficiently. This periodic action enables faster material removal compared to continuous mechanical drilling, increasing productivity while maintaining cavity structural integrity through controlled, incremental ablation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the productivity of the cavity process for mounting electronic components, reduces component size, and maintains compatibility with various communication standards by enabling efficient integration of components like antennas and baseband modems in a system-in-package (SiP) format.
Implementation Method 1
having a cavity in which a stopper layer is disposed on a bottom surface of the cavity
Data Source
AI summary
A substrate having an electronic component embedded therein includes a core substrate including first and second wiring layers disposed on different levels and one or more insulating layers disposed between the first and second wiring layers, having a cavity in which a stopper layer is disposed on a bottom surface of the cavity, and including a groove disposed around the stopper layer on the bottom surface; an electronic component disposed on the stopper layer in the cavity; an insulating material covering at least a portion of each of the core substrate and the electronic component and disposed in at least a portion of each of the cavity and the groove; and a third wiring layer disposed on the insulating material. The stopper layer protrudes on the bottom surface.