Embedded Substrate Printed Circuit Board Design
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Solution Overview
Problem
The increasing demand for camera pixels and larger speakers in electronic devices, such as smartphones, necessitates a more efficient use of space on printed circuit boards to accommodate these components, while existing multilayer structures require complex manufacturing processes and multiple boards, leading to increased costs and potential defects.
Innovation Solution
A printed circuit board design featuring a first substrate with a through portion, a second substrate disposed within this portion, and a flexible substrate connecting them, allowing for a multilayer structure without the need for separate interposer or sub-boards, enabling efficient space utilization and simplified assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a multilayer structure is formed using separate interposer or sub-boards, then component mounting space is secured, but the manufacturing process becomes complex and costs increase
Solution Approach 1:
The patent applies nesting by placing the second substrate inside a through portion of the first substrate, creating a nested configuration where one substrate is embedded within another. This eliminates the need for separate interposer or sub-boards, simplifying the manufacturing process while maintaining adequate component mounting space on both substrates.
2Area of moving object
If multiple separate boards are used to accommodate camera and speaker components, then sufficient mounting space is provided, but the number of assembly steps increases
Solution Approach 1:
The patent merges multiple substrate functions into a integrated structure where the first and second substrates are combined through the through portion configuration. This consolidation reduces the number of separate assembly steps required while providing sufficient mounting space for camera and speaker components on both substrates.
Data Source
AI summary
The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.