Embedded Substrate Planar Metal Layer Thickness Reduction
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Solution Overview
Problem
Electronic component-embedded substrates face challenges in maintaining a slim thickness due to the inclusion of electronic components, leading to increased substrate thickness.
Innovation Solution
The design incorporates a core structure with an insulating layer, a first wiring layer, a through-portion for the electronic component, an insulator, and metal layers that connect the wiring layer to the component's electrodes without additional vias, allowing for a reduced overall thickness by ensuring the metal layers are thicker than the wiring layers and providing an electrical connection path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electronic component is embedded in the substrate to provide electrical connection, then electrical connectivity is improved, but the substrate thickness increases
Solution Approach 1:
The patent transitions from traditional vertical via-based electrical connection to a planar metal layer connection approach. The first metal layer extends in the horizontal plane to simultaneously connect the first wiring layer and the connection electrode, eliminating the need for additional vertical vias and reducing substrate thickness while maintaining electrical connectivity.
Solution Approach 2:
The patent merges the functions of the first wiring layer, connection structure, and electrical connection path into an integrated configuration. The first metal layer serves as both a connection structure and an electrical connection path, combining multiple functions into a single element that reduces overall complexity and thickness.
2Reliability
If additional vias are used to connect wiring layer to component electrodes, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines the wiring layer, connection structure, and electrical connection path into an integrated configuration. The first metal layer serves multiple functions simultaneously as both a connection structure and an electrical connection path, eliminating the need for separate via structures and reducing overall device complexity.
Solution Approach 2:
The patent extracts and eliminates the via structure from the traditional electrical connection path. By removing the via and using a planar metal layer extension instead, the design simplifies the connection structure while maintaining electrical connectivity between the wiring layer and component electrodes.
Data Source
AI summary
An electronic component-embedded substrate of the present disclosure includes a core structure including an insulating layer, a first wiring layer disposed on an upper surface of the insulating layer and a through-portion passing through the insulating layer; a first electronic component disposed in the through-portion and including a connection electrode; an insulator disposed in a portion of the through-portion between the core structure and a portion of the first electronic component; and a first metal layer disposed on an upper surface of the insulator. At least a portion of the first metal layer is included on the first wiring layer and physically in contact with at least a portion of the connection electrode.