Component-Embedded Substrate Pressure Balancing
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Solution Overview
Problem
Conventional component-embedded substrates face issues such as tilting of embedded electronic components during the heating and compression process due to nonuniform pressure application, leading to bonding failures between wiring conductors and interlayer connectors.
Innovation Solution
Incorporating auxiliary members within the multilayer body, electrically insulated from wiring conductors, to balance pressures on terminal electrodes during the heating and compression process, ensuring uniform pressure distribution and preventing tilting and bonding failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform pressure is applied to both surfaces of the multilayer body during heating and compression, then the manufacturing process is simple, but nonuniform pressure is applied to junctions of electrodes and interlayer connectors causing tilting and bonding failure
Solution Approach 1:
The patent introduces auxiliary members (insulating members or spacers) at specific locations within the multilayer body to create local structural modifications. These members are positioned to provide additional support or pressure distribution at critical junctions where electrodes meet interlayer connectors, thereby achieving nonuniform pressure distribution in a controlled manner that prevents tilting and bonding failure while maintaining overall process simplicity
Solution Approach 2:
The auxiliary members act as intermediary elements between the compression force and the electrode-interlayer connector junctions. By introducing these intermediate structures, the patent mediates the pressure transmission to ensure uniform force distribution at critical bonding interfaces, preventing both excessive localized pressure and insufficient support that would cause tilting
2Manufacturing precision
If auxiliary members are added to balance pressure on terminal electrodes, then pressure distribution uniformity is improved, but device complexity increases
Solution Approach 1:
The auxiliary members are designed to serve multiple functions simultaneously: they act as spacers for pressure distribution, provide electrical insulation between conductive elements, and serve as structural support during the heating and compression process. This multi-functionality reduces the need for separate components and minimizes overall device complexity while achieving the pressure balancing objective
Solution Approach 2:
The patent employs auxiliary members made from the same insulating material as the base resin layers, creating a homogeneous structure throughout the multilayer body. This material uniformity simplifies manufacturing processes and reduces the number of different material types that would need to be handled separately, thereby offsetting the complexity increase from adding additional members
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The auxiliary members effectively balance pressures on terminal electrodes, preventing tilting and bonding failures, thereby ensuring reliable electrical connections and structural integrity of the component-embedded substrates.
Implementation Method 1
The heat press plates 609a, 609b apply pressure and heat to the multilayer body at both surfaces thereof. As a result, the resin layers 606a to 606e may be softened
Implementation Method 2
the resin layers 606a to 606e may be softened, and adjacent ones of the resin layers 606 may be adhered to each other
Implementation Method 3
the electrically-conductive paste may be sintered and changed into an alloy, whereby the interlayer connectors 605 electrically coupling the wiring conductors 604 to each other are formed
Data Source
AI summary
A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body.