Embedded Component Substrate Connection for Reduced Width
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Solution Overview
Problem
Existing substrates with embedded electronic components face an increase in width due to increased thickness of electronic components, necessitating a solution that maintains a compact size.
Innovation Solution
The use of spherical cores with varying diameters for substrate connecting members, where a smaller core is used on the second substrate, combined with a conductive member to form a consolidated connection, maintains a compact width despite increased thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of electronic component is increased, then the electronic component can accommodate more functional elements, but the width of substrate connecting members must be increased, resulting in the substrate becoming larger in the width direction
Solution Approach 1:
The substrate connecting member is segmented into multiple cores (first core and second core) with different diameters. The first core has a larger diameter to accommodate the increased thickness, while the second core has a smaller diameter. This segmentation allows the connecting member to maintain electrical connectivity without requiring a uniform increase in width across the entire substrate, thereby resolving the contradiction between component thickness and substrate width.
Solution Approach 2:
Different portions of the substrate connecting member have different diameters - the first core has a larger diameter suitable for thicker components, while the second core has a smaller diameter. This local variation in quality allows the connecting member to adapt to the increased thickness requirement in specific areas without expanding the overall substrate width, thus resolving the technical contradiction.
Data Source
AI summary
A substrate with an embedded electronic component includes a first substrate, a second substrate on which an electronic component is mounted, connecting member electrically and a substrate connecting a first pad of the first substrate and a second pad of the second substrate, wherein the first substrate is disposed opposite the second substrate across the electronic component, wherein the substrate connecting member includes a first core in contact with the first pad, a second core in contact with the first core and the second pad, and a conductive member covering the first core and the second core, and in contact with the first pad and the second pad, and wherein the first core and the second core are spherical, and a diameter of the second core is smaller than a diameter of the first core.