Embedded Component Substrate With Sidewall Interconnects for Smaller Packages
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Solution Overview
Problem
Integrated circuit packages face challenges in achieving a small form factor, low cost, and high performance due to increased complexity and the incorporation of passive components, which often results in larger size and higher manufacturing costs.
Innovation Solution
A substrate with a multilayer dielectric-metal structure that includes sidewalls defining an embedding region, where components are embedded and connected through patterned metal structures along the sidewalls, eliminating the need for laser drilling and allowing for more routing options and reduced package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components are incorporated into an integrated device package to improve circuit performance, then electrical performance is improved, but the size of the integrated device package increases
Solution Approach 1:
The patent embeds passive components (inductors, capacitors, resistors) within the substrate structure itself, nesting them inside the multilayer dielectric-metal framework. This allows the components to occupy space within the substrate volume rather than adding external volume, thereby improving electrical performance while minimizing package size increase.
Solution Approach 2:
The patent utilizes vertical stacking with multiple dielectric and metal layers to accommodate passive components in the third dimension. By transitioning from a planar two-dimensional layout to a three-dimensional multilayer architecture, the substrate can integrate more functionality without increasing the lateral footprint, thus improving performance while controlling package size.
2Volume of moving object
If a smaller form factor is achieved for integrated device packages, then device size is reduced, but manufacturing cost increases
Solution Approach 1:
The patent merges the substrate structure with passive component housings and interconnect pathways into a single integrated multilayer dielectric-metal structure. This consolidation eliminates the need for separate component packages and interconnection structures, reducing overall device size while lowering manufacturing costs through simplified assembly processes and reduced material requirements.
Solution Approach 2:
The multilayer dielectric-metal structure serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, and housing for passive components. This multi-functionality reduces the need for separate dedicated structures for each function, thereby reducing overall device size and manufacturing cost while maintaining the required performance characteristics.
Data Source
AI summary
A device includes a substrate that includes a multilayer dielectric-metal structure including sidewall(s) that define an embedding region within the multilayer dielectric-metal structure. The multilayer dielectric-metal structure includes dielectric layers and metal layers patterned to define metal lines. The multilayer dielectric-metal structure also includes component(s) disposed within the embedding region. The substrate includes PID layers coupled to surfaces of the multilayer dielectric-metal structure and to surfaces of the component(s). The substrate also includes a metal structure including a portion in contact with at least one of the sidewall(s) of the multilayer dielectric-metal structure and at least one sidewall of one of the component(s), where the portion of the metal structure electrically couples a component and the metal lines of the multilayer dielectric-metal structure.