Embedded Substrate Structure for Signal Loss Reduction
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Solution Overview
Problem
Conventional substrate structures with surface-mounted and embedded electronic components face increased internal resistance and signal loss due to the need for via connections, which also complicate manufacturing processes.
Innovation Solution
A substrate structure with a cavity in the substrate, where a first electronic component is embedded and a second component is surface-mounted, with a plated terminal and filler for direct electrical connection, and additional circuit patterns on both surfaces, simplifying the connection process and reducing internal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are connected using vias and wiring patterns, then electrical connection between components is achieved, but internal resistance increases and signal loss occurs
Solution Approach 1:
The patent transitions from planar 2D connections (vias and wiring patterns on substrate surfaces) to 3D vertical connections by embedding electronic components directly within the substrate volume. This dimensional change eliminates the need for lengthy lateral signal paths through vias and wiring, reducing internal resistance and signal loss while maintaining electrical connectivity.
Solution Approach 2:
The patent embeds electronic components within the substrate structure, nesting components inside the substrate volume rather than mounting them on the surface. This nesting approach shortens current paths by allowing direct vertical connections between embedded and surface components, reducing the number of via connections required and minimizing signal loss.
2Reliability
If vias are formed to connect electronic components, then electrical connection is established, but manufacturing process complexity increases
Solution Approach 1:
The patent extracts and eliminates the via formation process from the manufacturing sequence by using direct vertical connections between embedded and surface components. This removes the need for complex via drilling, plating, and insulation steps, significantly simplifying the manufacturing process while maintaining reliable electrical connectivity.
Solution Approach 2:
By moving connections from the 2D plane (requiring vias) to the 3D volume (using vertical direct bonds), the patent eliminates the need for via formation processes. This dimensional transition simplifies manufacturing by reducing the number of process steps required to establish electrical connections between components.
3Reliability
If multiple via connections are used to connect surface-mounted and embedded components, then electrical connectivity is achieved, but current path length increases
Solution Approach 1:
By nesting electronic components within the substrate volume and establishing direct vertical connections, the patent dramatically shortens current paths compared to surface-mounted connections requiring multiple vias. The embedded configuration allows current to flow directly between components through minimal vertical paths, reducing overall current path length and improving electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes signal loss and internal resistance by direct contact between plated terminals and circuit patterns, and simplifies manufacturing by reducing the number of processes required for connection.
Implementation Method 1
the plated terminal and the second terminal may be in direct contact with each other by solder
Implementation Method 2
a filler for filling a space between the cavity and the first electronic component
Data Source
AI summary
The present invention relates to a substrate structure having electronic components and a method of manufacturing a substrate structure having electronic components and can reduce signal loss and internal resistance and improve process efficiency by bringing a first terminal of a first electronic component and a second terminal of a second electronic component in direct contact with each other or in direct contact with each other by solder to minimize a path between the electronic components.