Embedded Package Substrate with Stepped-Hole Interconnects
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Solution Overview
Problem
The existing semiconductor packaging methods are cumbersome and costly, particularly when forming small-sized cavities, leading to waste of outer substrate circuits and increased manufacturing costs due to the complexity of the process flow and the need to embed components before completing the substrate circuit.
Innovation Solution
A method for manufacturing a component package substrate structure where a component is embedded after the substrate circuit is completed, using a stepped hole to establish conduction between the component and the circuit, reducing waste and processing time by postponing the component embedding process until circuit quality is detected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are embedded in cavities before substrate circuit completion, then component packaging can be performed early, but the process flow becomes complicated and outer substrate circuits are wasted
Solution Approach 1:
The patent applies preliminary action by embedding components on a temporary bearing plate before the substrate circuit is completed. The temporary bearing plate allows component embedding to occur in advance, and the component can be subsequently transferred to the final substrate position after circuit completion, thus performing the embedding action beforehand without compromising the final circuit integrity
Solution Approach 2:
The temporary bearing plate serves as an intermediary carrier that enables component embedding before the final substrate is ready. This intermediary structure allows the component to be held and processed separately, then transferred to the substrate after circuit completion, avoiding the need to complete the entire substrate circuit first
2Loss of time
If components are embedded before substrate circuit completion, then packaging can start earlier, but outer substrate circuits are discarded as useless
Solution Approach 1:
The patent performs preliminary component embedding on a temporary bearing plate before the substrate circuit is completed. This allows the component packaging process to start earlier without wasting substrate circuits, as the component can be transferred to the final substrate position after circuit completion and quality detection
Solution Approach 2:
The patent recovers the temporary bearing plate for reuse after component transfer. Instead of discarding the temporary bearing plate after component embedding, the component is transferred to the substrate, and the temporary bearing plate can be reused for subsequent components, reducing waste
3Manufacturing precision
If small-sized cavities are formed by pattern transfer etching, then precise component embedding is achieved, but manufacturing cost and processing time increase
Solution Approach 1:
The patent uses a temporary bearing plate as a disposable or reusable temporary structure that simplifies the embedding process. Instead of forming complex small-sized cavities in the final substrate, the temporary bearing plate provides a simpler platform for component placement, reducing manufacturing complexity and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves packaging yield, reduces processing time and costs, and avoids discarding components due to poor substrate circuits by embedding components only after the circuit quality is verified, thus enhancing the integration and efficiency of the packaging process.
Implementation Method 1
a conductive column filling at least the second via hole and the opening of the connection pad to make the connection pad be conductive with the circuit layer
Implementation Method 2
electroplating the stepped hole to form a conductive column
Data Source
AI summary
A method for manufacturing a component package substrate structure includes providing a first temporary bearing plate, fitting components, applying a first dielectric layer to embed the components in the first dielectric layer, applying a second temporary bearing plate, removing the first temporary bearing plate, forming a connection pad for connecting an element terminal on the first dielectric layer, laminating a second dielectric layer on the first dielectric layer, laminating a circuit board on the second dielectric layer, removing the second temporary bearing plate, opening a stepped hole on the second surface, wherein the stepped hole includes a first via hole penetrating the first dielectric layer, an opening of an annular ring structure of the connection pad and a second via hole penetrating the second dielectric layer, and electroplating the stepped hole to form a conductive column, wherein the conductive column renders the connection pad conductive with the circuit layer.