Embedded Substrate Stopper Layer Composite Coating
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Solution Overview
Problem
Substrates with embedded electronic components face reliability issues due to interfacial delamination caused by warpage and thermal cycles, particularly when using materials with different coefficients of thermal expansion, leading to poor bonding between the stopper layer and adhesive materials.
Innovation Solution
A substrate design featuring a core structure with a cavity and a stopper layer, where the stopper layer's surface is coated with a composite of metal material, inorganic particles, and insulating resin, improving mechanical strength and thermal stability, and enhancing adhesive force through selective surface roughness and material distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a die with low coefficient of thermal expansion is inserted into an organic composite material with high coefficient of thermal expansion, then thermal expansion difference is created, but interfacial delamination occurs due to warpage and thermal cycles
Solution Approach 1:
The patent applies composite materials by creating a multi-layer stopper structure consisting of a first stopper layer (metal material), a second stopper layer (inorganic particles and insulating resin), and a third stopper layer (metal material). This composite structure combines materials with different thermal expansion coefficients to match the CTE between the organic composite material and the die, thereby reducing thermal stress and preventing interfacial delamination while maintaining bonding reliability
Solution Approach 2:
The patent applies local quality by providing different material compositions at different locations and depths within the stopper structure. The first stopper layer uses metal material for structural support, the second layer uses inorganic particles and insulating resin for CTE matching and insulation, and the third layer uses metal material for electrical connectivity. This localized material differentiation allows each layer to perform its specific function while collectively solving the thermal expansion mismatch problem
2Reliability
If the stopper layer surface is coated with composite material, then adhesive force is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-forming the multi-layer stopper structure with optimized material composition and surface properties before die attachment. The stopper layers are constructed with specific materials (metal, inorganic particles, insulating resin) in predetermined sequences and thicknesses, and the surface is pre-treated with appropriate coatings or roughness characteristics to ensure optimal adhesive bonding. This preliminary preparation eliminates the need for complex post-assembly modifications and simplifies the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances bonding reliability and thermal stability, reducing the likelihood of interfacial delamination and improving the substrate's performance under thermal cycles and humidity tests.
Implementation Method 1
a surface of the stopper layer facing the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin
Implementation Method 2
there may be a difference in coefficients of thermal expansion such that various issues related to reliability may occur
Data Source
AI summary
A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.