Embedded Substrate Stress Relieving Layer
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Solution Overview
Problem
In electronic component embedded substrates, the reduction in height leads to deformation of the dielectric layer due to external forces, as the existing technologies fail to effectively mitigate the impact of such forces on the components.
Innovation Solution
Incorporating a stress relieving layer with a lower Young's modulus than the electrode layer, positioned closer to the wiring layer, which contacts the electronic component's end portions, helps to relieve external forces and maintain insulation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the height of the electronic component is reduced to achieve miniaturization, then the overall size and thickness are decreased, but the dielectric layer and electrode layers become susceptible to deformation under external forces
Solution Approach 1:
A stress relieving layer is introduced as an intermediary between the electronic component and the substrate. This layer has a lower Young's modulus than the electrode layer, allowing it to absorb and distribute external forces applied to the substrate, thereby protecting the dielectric layer from deformation while maintaining the component's miniaturized height
2Stability of the object's composition
If a stress relieving layer with lower Young's modulus is added to protect the electronic component from external forces, then deformation resistance is improved, but the structural complexity and number of layers increase
Solution Approach 1:
The stress relieving layer is designed with specific parameter characteristics - a Young's modulus lower than the electrode layer but higher than the insulating layer. This parameter optimization allows the layer to effectively relieve stress while maintaining structural integrity, achieving protection without excessive complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stress relieving layer effectively suppresses the influence of external forces on the electronic component, reducing deformation and ensuring insulation and electrical connection integrity.
Implementation Method 1
a Young's modulus of the stress relieving layer is lower than a Young's modulus of the electrode layer positioned on the wiring layer side
Data Source
AI summary
An electronic component embedded substrate 1 includes a substrate 10 having a wiring layer 11 and an insulating layer 12; an electronic component 20 built in the substrate 10, and having a pair of electrode layers 21A and 21B, and a dielectric layer 22; and a stress relieving layer 30 provided closer to the wiring layer 11 than the insulating layer 12 is in the lamination direction, wherein at least part of an end portion of the electronic component 20 on the wiring layer 11 side is in contact with the stress relieving layer 30, wherein at least part of an end portion of the electronic component 20 on the insulating layer 12 side is in contact with the insulating layer 12, and wherein the Young's modulus of the stress relieving layer 30 is lower than the Young's modulus of the electrode layer 21B.