Embedded Semiconductor Substrate Layout for Thermal Interference Suppression
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Solution Overview
Problem
Existing semiconductor devices experience thermal interference between adjacent semiconductor elements due to heat conduction through shared heat dissipation members, leading to potential damage and increased size and inductance, which affects switching speed and efficiency.
Innovation Solution
Incorporating a thermal interference suppression member between heat dissipation members to dissipate heat externally, reducing thermal conduction between adjacent semiconductor elements and minimizing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If heat dissipation members are shared between adjacent semiconductor elements, then device complexity is reduced, but thermal interference occurs between semiconductor elements
Solution Approach 1:
The heat dissipation function is segmented into separate members for each semiconductor element. First heat dissipation member is coupled to first semiconductor element, second heat dissipation member is coupled to second semiconductor element, preventing thermal interference while maintaining structural organization.
Solution Approach 2:
A thermal interference suppression member is introduced as an intermediary between the first and second heat dissipation members. This member blocks thermal conduction paths that would otherwise allow heat to transfer between adjacent semiconductor elements, eliminating thermal interference without requiring complete structural separation.
2Object-affected harmful factors
If thermal interference suppression member is added between heat dissipation members, then thermal interference is suppressed, but device complexity increases
Solution Approach 1:
The thermal interference suppression member acts as a mediator that blocks heat flow between adjacent heat dissipation members. It is embedded in the substrate between the first and second heat dissipation members, providing thermal isolation while integrating seamlessly into the existing device structure.
Solution Approach 2:
The thermal interference suppression member provides localized thermal management only where needed - between adjacent heat dissipation members. Other regions of the device maintain their original heat dissipation characteristics, allowing targeted intervention without global structural changes.
3Volume of moving object
If semiconductor elements are arranged with small gap, then device size is reduced, but thermal interference increases
Solution Approach 1:
The thermal interference suppression member is positioned in the substrate between heat dissipation members, providing thermal isolation even when semiconductor elements are closely spaced. This allows compact device layout without sacrificing thermal management effectiveness.
Solution Approach 2:
Thermal isolation is achieved in the vertical dimension (through the substrate) rather than requiring horizontal separation between elements. The suppression member extends in the thickness direction, blocking thermal paths three-dimensionally while maintaining compact planar footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Suppresses thermal interference, prevents damage to semiconductor elements, reduces device size, and maintains high switching speed by effectively dissipating heat, thereby improving efficiency and reducing material costs.
Implementation Method 1
a thermal interference suppression member embedded in the board and disposed between the first heat dissipation member and the second heat dissipation member to dissipate heat
Data Source
AI summary
A semiconductor device includes a component-embedded substrate that includes a board, first and second semiconductor elements, first and second heat dissipation members, and a thermal interference suppression member. The first and second semiconductor elements are embedded in the board and arranged with a gap therebetween in a direction perpendicular to a thickness direction of the board. The first heat dissipation member is embedded in the board and connected to the first semiconductor element in the thickness direction. The second heat dissipation member is embedded in the board and connected to the second semiconductor element in the thickness direction. The thermal interference suppression member is embedded in the board and disposed between the first heat dissipation member and the second heat dissipation member to dissipate heat.