Embedded Substrate Layout for Mixed-Size Components and Via Ratios
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Solution Overview
Problem
The integration of electronic components of different sizes in semiconductor package structures poses challenges due to the need for vias with greater aspect ratios, complicating manufacturing processes like laser drilling and electroplating, and affects impedance matching and layout design.
Innovation Solution
A substrate structure is designed with electronic components of varying sizes, where the number of metal layers above a smaller component exceeds those above a larger component, optimizing via aspect ratios and enhancing electrical connections through symmetrical placement, thereby improving manufacturing yield and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electronic components of different sizes are embedded in the substrate, then the integration density is improved, but the manufacturing difficulty increases due to greater via aspect ratios
Solution Approach 1:
The patent applies local quality by configuring different numbers of metal layers above different electronic components based on their specific size requirements. Smaller components are positioned under regions with greater metal layer stacks, while larger components are positioned under regions with fewer metal layers. This localized differentiation optimizes via aspect ratios for each component type, making manufacturing more feasible while maintaining high integration density.
2Quantity of substance
If electronic components of different sizes are embedded in the substrate, then the integration density is improved, but the manufacturing precision deteriorates due to greater via aspect ratios
Solution Approach 1:
The patent implements local quality by creating spatially varying metal layer configurations above different component regions. This ensures that via aspect ratios are optimized locally for each component size, with smaller components receiving support from taller metal stacks that provide better mechanical support and electrical connection, while larger components are served by shorter stacks. This localized optimization maintains manufacturing precision across diverse component sizes.
3Adaptability or versatility
If terminals on two opposing sides of the electronic component are at different distances to an adjacent surface, then the component can be positioned flexibly, but the impedance matching deteriorates
Solution Approach 1:
The patent applies asymmetry by intentionally creating non-uniform metal layer configurations above different electronic components. The number of metal layers varies depending on the component size and position, creating asymmetric structures that are optimized for each component's specific electrical requirements. This asymmetric design enables flexible layout arrangements while maintaining proper impedance matching for each component type through tailored metal stack heights.
Data Source
AI summary
A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic component is disposed within the substrate and arranged in a horizontal direction with the first electronic component. The metal layers are disposed above an upper surface of the substrate. The number of metal layers above the first electronic component is greater than the number of metal layers above the second electronic component.