Embedded Substrate Voltage Regulators for Low-Loss Power Delivery
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Solution Overview
Problem
Conduction losses between power supplies and loads in integrated circuits (ICs) are significant due to lateral current conduction, and integrating voltage converters within the same silicon die as the ICs leads to yield reduction and interference issues, while separate integration on circuit boards results in undesirable power loss and electromagnetic interference.
Innovation Solution
Embedding inductors and capacitors of the voltage converter within a package substrate, with vertical current flow and shielding to minimize lateral conduction and interference, and using a coupled inductor to reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If voltage regulator is integrated into the same die as the digital IC, then conduction losses are reduced, but manufacturing yield decreases and interference issues occur
Solution Approach 1:
The patent divides the system into separate components: the digital IC remains on its own die while the voltage regulator is implemented as a separate integrated circuit. These are then connected through a package substrate with embedded power delivery networks, achieving low conduction loss without compromising the digital IC's manufacturing yield.
Solution Approach 2:
The voltage regulator IC is embedded within the package substrate cavity, creating a nested structure where the regulator sits inside the package housing. This allows close proximity for efficient power delivery while maintaining physical separation to avoid interference and yield issues.
2Loss of energy
If voltage regulator is placed on circuit board near the load, then conduction losses are minimized, but electromagnetic interference increases
Solution Approach 1:
The patent transitions from planar placement on the circuit board to three-dimensional embedding within the package substrate. The voltage regulator IC is positioned in a cavity within the package substrate, vertically adjacent to the digital IC, reducing lateral trace lengths while containing electromagnetic fields within the structured package environment.
3Speed
If silicon feature sizes are reduced to increase speed and performance, then processing capability improves, but supply voltage must decrease
Solution Approach 1:
The patent addresses the voltage scaling challenge by implementing a high-efficiency power delivery system with embedded power networks and low-impedance connections. This allows the digital IC to operate at lower voltages required by small feature sizes while maintaining adequate power delivery through optimized power distribution architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces power loss and electromagnetic interference while maintaining modularity, allowing for efficient power delivery to ICs with minimal interference and higher system density.
Implementation Method 1
use of a coupled inductor to reduce the switching node interference
Implementation Method 2
with vertical current flow and shielding to minimize lateral conduction and interference
Data Source
Figure 1~2
Figure 3A~3C
Figure 4A
AI summary
Voltage converter inlay modules are provided for embedding within a package substrate, and are configured to supply power to a processor, or similar digital circuit, which is mounted to the package substrate. The package substrate is typically mounted to a circuit board, or similar. The circuit board provides high-voltage, low-current power to the voltage converter module which, in turn, provides low-voltage high-current power to the processor. The voltage converter inlay provides largely vertical current conduction from the circuit board to the processor, thereby reducing conduction losses incurred by lateral current conduction. The location of the voltage converter inlay between the circuit board and the microprocessor minimizes radiation of electromagnetic interference. The number of terminals allocated for providing power to the package substrate may be minimized due to the voltage converter inlay inputting fairly low levels of current. The high-current power required by the processor is constrained within the package substrate.