Electronic Component-Embedded Substrate Warpage Reduction
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Solution Overview
Problem
The increasing demand for high-performance and miniaturized electronic devices limits the number of electronic components that can be mounted on printed circuit boards, necessitating a technology to enhance mounting density and reduce warpage while improving yield.
Innovation Solution
An electronic component-embedded substrate is designed with a module structure that includes support members, resin layers, and insulating materials, featuring a shortened electrical connection path through through-vias and build-up structures, allowing for increased component density and reduced warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic components are mounted on the surface of the printed circuit board, then the manufacturing process is simple, but the mounting density is limited and the electrical connection path is long
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional embedding by placing electronic components within the thickness direction of the substrate. Through-holes penetrate the substrate to hold components internally, while build-up structures extend vertically to provide electrical connections, effectively utilizing the third dimension to increase mounting density without complicating the manufacturing process
2Quantity of substance
If electronic components are embedded in the substrate, then the mounting density increases, but the electrical connection path becomes complex
Solution Approach 1:
The electrical connection system is segmented into distinct functional parts: through-holes provide mechanical support and initial electrical pathways, resin layers provide insulation and structural continuity, and build-up structures provide dedicated vertical connection paths. This segmentation allows each component to perform its specific function efficiently, simplifying the overall connection architecture despite the three-dimensional embedding configuration
3Adaptability or versatility
If the number of electronic components is increased, then the functionality improves, but the warpage of the substrate increases
Solution Approach 1:
The substrate structure is made non-uniform with localized variations in thickness and material composition. Build-up structures are strategically positioned to provide additional mechanical support and electrical connections at specific locations where components are embedded. This local reinforcement allows the substrate to accommodate multiple embedded components while maintaining overall dimensional stability and reducing warpage
Data Source
AI summary
An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.