Embedded Component Substrate Warpage Control via Layered Resin
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Solution Overview
Problem
Existing electronic component built-in substrates face reliability issues due to unbalanced stress and heat-induced warpage and expansion, which affect the conductive patterns and lead to decreased reliability.
Innovation Solution
A substrate with a built-in electronic component is manufactured by forming an insulating layer using multiple resin layers with varying additive ratios to adjust hardness, incorporating a conductive columnar electrode for connecting conductive patterns, and employing a semi-additive method for pattern formation to prevent warpage and facilitate electroless plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick insulating layer is formed to embed the electronic component, then the electronic component can be properly embedded, but stress becomes unbalanced between front and rear sides of the substrate causing warpage
Solution Approach 1:
The insulating layer is divided into multiple sub-layers (first insulating layer, second insulating layer, third insulating layer) with different thicknesses and material compositions. This segmentation allows stress distribution and prevents warpage while still providing sufficient embedding depth for the electronic component.
Solution Approach 2:
Different regions of the insulating layer have different material compositions and thicknesses. The first insulating layer has higher dielectric constant than the third insulating layer, and each layer is optimized for its specific function (embedding, stress management, or planarization).
2Temperature
If the insulating layer undergoes heat cycle expansion and contraction, then thermal effects are generated, but this causes problems in conductive patterns and decreases reliability
Solution Approach 1:
Different insulating layers have different material properties including different dielectric constants and thermal expansion characteristics. This local differentiation allows each layer to respond differently to thermal cycling, reducing overall stress on conductive patterns.
Solution Approach 2:
The insulating structure uses composite material composition across different layers, with each layer having optimized material properties for its specific function. This composite approach manages thermal expansion differences and reduces warpage during temperature cycles.
3Device complexity
If a single resin layer is used for the insulating layer, then the structure is simple, but stress balance and warpage control are insufficient
Solution Approach 1:
The insulating layer is divided into multiple sub-layers with different thicknesses and material compositions. This segmentation provides stress management capability and warpage prevention while maintaining a relatively simple overall structure that can be manufactured using standard processes.
Data Source
AI summary
A substrate with built-in electronic components includes a substrate on which a first conductive pattern is formed; an electronic component mounted on the substrate; an insulting layer which is formed by stacking a plurality of resin layers including indifferent additive ratios an additive material for adjusting hardness; a second conductive pattern formed on the insulating layer; and a conductive post for connecting the first conductive pattern to the second conductive pattern.