Component Carrier With Embedded Switches and Vertical Capacitor
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Solution Overview
Problem
The integration of electronic switches, particularly transistors, in component carriers faces challenges such as high thermal resistance, compact design constraints, and the need for efficient electromagnetic interference (EMI) protection.
Innovation Solution
A component carrier design that includes a stack of electrically conductive and insulating layers, with two electronic switch components embedded side-by-side and a capacitor device connected in parallel, arranged to minimize distances and optimize thermal and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic switches are integrated in a component carrier, then switching functionality is achieved, but thermal performance deteriorates due to heat generation
Solution Approach 1:
The patent transitions from planar integration to three-dimensional stacking by placing the capacitor device above the electronic switches in the vertical direction. This vertical arrangement minimizes the loop area for high-frequency currents and optimizes thermal pathways, resolving the contradiction between achieving switching functionality and managing thermal performance.
2Volume of moving object
If electronic switches are embedded in a component carrier, then compact design is achieved, but electromagnetic interference protection deteriorates
Solution Approach 1:
By stacking the capacitor device above the electronic switches in the vertical dimension, the patent creates a compact three-dimensional arrangement that maintains small loop areas. This vertical stacking approach achieves compact design while preserving EMI protection by minimizing the horizontal footprint and optimizing current paths.
Solution Approach 2:
The capacitor device is positioned to partially cover the electronic switches in the vertical direction, creating a nested arrangement where components share spatial space efficiently. This nesting achieves compact design while maintaining electrical isolation and EMI protection through the layered structure.
3Productivity
If capacitor device is placed close to electronic switches, then switching efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent places the capacitor device in the vertical dimension above the electronic switches, achieving close proximity for improved switching efficiency without requiring complex lateral routing. This vertical arrangement simplifies manufacturing by utilizing standard multi-layer PCB stacking techniques rather than complex surface mount configurations.
Data Source
AI summary
A component carrier, including: i) a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; ii) a first electronic switch component and a second electronic switch component embedded side-by-side in the stack; and iii) a capacitor device, electrically connected in parallel to the first electronic switch component and the second electronic switch component; wherein the capacitor device is assembled, in particular surface-mounted, to the stack, so that the first electronic switch component and the second electronic switch component are at least partially arranged below the capacitor device in a direction z, perpendicular to the directions of main extension x, y, of the component carrier.