Embedded Tantalum Capacitor Structure for High Density IMDs
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Solution Overview
Problem
The miniaturization of implantable medical devices (IMDs) requires smaller and more compact electronic components, particularly capacitors, to increase density and reduce size, while maintaining reliability and capacitance density, as traditional tantalum capacitors add significant thickness to integrated circuit boards.
Innovation Solution
The development of an electrical component featuring tantalum material with tantalum particles disposed within a substrate cavity, a dielectric layer, an electrolyte cathode layer, and conductive foil layers, which forms a compact capacitor suitable for IMDs, with a thickness of no greater than 600 micrometers, enabling embedding within integrated circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional tantalum capacitors are used, then capacitance density is achieved, but thickness increases significantly
Solution Approach 1:
The patent embeds the capacitor structure within a cavity of the substrate, nesting the electrical component inside the housing rather than mounting it externally. This nesting approach maintains high capacitance density while reducing the overall thickness of the device by utilizing internal space.
Solution Approach 2:
The patent transitions from traditional planar capacitor mounting to a three-dimensional cavity-based structure. By disposing tantalum particles within a substrate cavity and forming electrodes on opposite surfaces, the design optimizes space utilization in the vertical dimension, reducing thickness while maintaining capacitance.
2Volume of moving object
If device dimensions are reduced for miniaturization, then space utilization improves, but component density must increase
Solution Approach 1:
The patent concentrates the capacitor structure within a localized cavity region of the substrate, allowing high component density in a specific area while maintaining overall device miniaturization. The tantalum particles are disposed locally within the cavity, creating a high-density region that fits within the reduced device volume.
Solution Approach 2:
The patent uses a composite structure combining tantalum particles with a dielectric material formed on the particles. This composite approach enables high capacitance density within a compact volume, achieving both miniaturization and increased component density requirements.
3Length of stationary object
If capacitor thickness is reduced, then device miniaturization is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the capacitor into distinct functional layers: tantalum particles, dielectric layer, and electrode layers. This segmentation allows each component to be formed using specialized processes optimized for that material, simplifying the overall manufacturing of the thin-structure capacitor.
Solution Approach 2:
The patent replaces traditional mechanical capacitor construction with a particle-based tantalum structure and conformal dielectric deposition. This substitution enables thinner structures to be formed more easily, as the particle-based anode can be packed to desired densities and the dielectric can be deposited conformally to achieve uniform thin layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the creation of smaller, more compact IMDs with improved space utilization and reliability, as the electrical component achieves reduced thickness and increased capacitance density, addressing the size and space constraints in miniaturized IMDs.
Implementation Method 1
capacitors are passive components that store potential energy in an electric field and are designed to add capacitance to circuits
Implementation Method 2
an electrolyte cathode layer disposed on the dielectric
Data Source
AI summary
Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and a cavity disposed in the substrate. The cavity extends between the first major surface and the second major surface. The electrical component also includes an anode electrode that includes a conductive foil layer disposed on the second major surface of the substrate and over the cavity. Tantalum material is disposed within the cavity and includes tantalum particles. A dielectric layer is disposed on the tantalum particles, and an electrolyte cathode layer is disposed on the dielectric layer. The electrical component also includes a cathode electrode disposed over the cavity.