Embedded TEC Silicon Photonic Module Without Bonding Wires
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Solution Overview
Problem
The complex manufacturing process of optical modules due to the laser being connected to the PCB through a bonding alloy wire and then attached to the TEC is a challenge in existing 400G optical modules.
Innovation Solution
A 400G silicon photonic integrated optical module with an embedded TEC substrate, where the TEC substrate is embedded into the PCB substrate, and the silicon photonic integrated circuit board is provided on the TEC substrate, with components like the fiber array, electronic integrated circuit board, and light emission assembly arranged on the silicon photonic integrated circuit board, and the light emission assembly is mounted in an upside-down manner, omitting the need for a welding process of metal wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the laser is connected to the PCB through a bonding alloy wire and then attached to the TEC, then the laser can be electrically connected and thermally managed, but the manufacturing process becomes complex
Solution Approach 1:
The patent merges the electrical connection and thermal management functions into a single integrated structure. The TEC substrate is directly embedded into the PCB substrate, eliminating the need for separate bonding alloy wire connections. This integration simplifies the manufacturing process while maintaining reliable electrical and thermal connections between the laser and TEC components.
2Loss of energy
If the TEC is embedded into the PCB substrate, then heat dissipation is improved and manufacturing is simplified, but the structural integration becomes more challenging
Solution Approach 1:
The TEC substrate is pre-embedded into the PCB substrate during the PCB manufacturing process. This preliminary integration ensures proper alignment and thermal contact between the TEC and PCB, facilitating efficient heat dissipation. The embedded structure is formed before subsequent assembly steps, simplifying later manufacturing operations.
3Temperature
If the light emission assembly is mounted on the silicon photonic integrated circuit board in an upside-down manner, then the heat dissipation path is optimized, but the mounting precision requirements increase
Solution Approach 1:
The silicon photonic integrated circuit board serves as an intermediary platform that facilitates the upside-down mounting of the light emission assembly. The board's structured design includes dedicated mounting regions and thermal pathways that guide the assembly process, reducing the precision requirements while maintaining effective heat dissipation from the laser to the TEC substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process by eliminating the need for metal wire welding and ensures effective heat dissipation through the TEC substrate, maintaining normal operation and stability of the optical module.
Implementation Method 1
Heat from the light emission assembly can be dissipated through the TEC substrate
Implementation Method 2
The silicon photonic integrated circuit board is mounted on the PCB substrate and the TEC substrate through a flip chip
Data Source
AI summary
A 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate includes: a housing, a printed circuit board (PCB) substrate, and a silicon photonic integrated circuit board, where an accommodating cavity is formed in the housing; the PCB substrate is provided in the accommodating cavity; a TEC substrate is embedded into the PCB substrate; the silicon photonic integrated circuit board is provided on the TEC substrate; the silicon photonic integrated circuit board is provided with an extended segment; the extended segment extends to one side and to the PCB substrate; a fiber array, an electronic integrated circuit board, a light emission assembly, and a light-receiving detector are arranged on the silicon photonic integrated circuit board; the light emission assembly is mounted on the silicon photonic integrated circuit board; and the light emission assembly and the light-receiving detector are provided above the TEC substrate.