Embedded Terminal Semiconductor Device for Flexible Display Reliability

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Solution Overview

Problem

Portable information processing devices are prone to damage from accidental drops due to applied forces, and existing display devices with high adhesiveness between the light-emitting layer and second electrode layer do not adequately address the issue of reliability and convenience.

Innovation Solution

A semiconductor device with an insulating film, a first connection portion, and a terminal, where the terminal is embedded in and exposed through the insulating film, allowing for electrical connection to a circuit positioned between the insulating film and a flexible or bent base, enabling the supply of power and signals to the circuit and display elements, and a method for manufacturing this device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the display device uses high adhesiveness between light-emitting layer and second electrode layer, then durability against dropping is improved, but the device cannot be flexed or bent

Engineering Contradiction:
Improvedurability against droppingVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The device is divided into distinct functional layers: a flexible base, a light-emitting layer, an insulating film, and a second electrode layer. This segmentation allows the flexible base to provide bending capability while the other layers maintain structural integrity and adhesion for drop resistance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs thin film structures for the light-emitting layer, insulating film, and electrode layer that can conform to the flexible base. These thin films enable the device to be flexed or bent while maintaining functionality and durability.

Inventive Principle:
Principle #30Flexible shells and thin films

2Stability of the object's composition

If a rigid base is used for the display device, then structural stability is improved, but the device cannot be flexed or bent

Engineering Contradiction:
Improvestructural stabilityVSAvoidflexibility
Core Design Contradiction:
Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The patent replaces rigid bases with flexible bases that have appropriate mechanical properties. The flexible base provides structural stability while enabling bending, eliminating the need for rigid support structures.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The device uses composite material structures where the flexible base is combined with light-emitting layers, insulating films, and electrode layers. This composite structure achieves both flexibility and structural stability simultaneously.

Inventive Principle:
Principle #40Composite materials

3Reliability

If the insulating film thickness is increased, then electrical insulation is improved, but light reflection increases reducing visibility

Engineering Contradiction:
Improveelectrical insulationVSAvoidlight reflection
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The patent optimizes the thickness parameter of the insulating film to achieve the desired balance between electrical insulation and light transmission. By carefully controlling the thickness within specific ranges, both insulation performance and optical properties are satisfied.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10978489B2Semiconductor device, display panel, method for manufacturing semiconductor device, method for manufacturing display panel, and information processing device
Publication Date: 2021.04.13 SEMICON ENERGY LAB CO LTD
  • US10978489B2 patent drawing
  • US10978489B2 patent drawing
  • US10978489B2 patent drawing

AI summary

To provide a novel semiconductor device that is highly convenient or reliable, a novel display panel that is highly convenient or reliable, or a method for manufacturing a novel semiconductor device that is highly convenient or reliable. The semiconductor device includes an insulating film having an opening, a first connection portion penetrating the opening, a terminal that is in contact with one surface of the insulating film and is electrically connected to the first connection portion, and a circuit that is electrically connected to the first connection portion on the opposite surface of the insulating film. The terminal has a region embedded in the insulating film and a region not covered with the insulating film. The circuit includes a semiconductor element.