Embedded External Terminal Layout for Compact Semiconductor Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power semiconductor modules are difficult to downsize due to long wiring lengths for external terminals connecting semiconductor chips to external circuits.
Innovation Solution
A semiconductor device design featuring an insulated circuit board with a conductive layer, a semiconductor chip sealed by resin, and an external terminal with a lower portion embedded in the resin and an upper portion projecting above the resin surface, allowing for shorter wiring lengths and downsizing by incorporating a nut or screw as an external terminal that fastens above the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional external terminals with long wiring lengths are used to connect semiconductor chips to external circuits, then reliable electrical connections are achieved, but the device size increases
Solution Approach 1:
The external terminal is configured to extend in the thickness direction (vertical dimension) of the semiconductor device rather than only in the planar direction. By having the terminal penetrate through the sealing resin from the top surface and extend upward, the electrical connection is achieved in the vertical dimension, thereby shortening the planar wiring length and reducing the device footprint while maintaining connection reliability
Solution Approach 2:
The external terminal is pre-configured with a lower portion embedded in the sealing resin that makes contact with the circuit board conductive layer, and an upper portion that projects above the sealing resin surface. This preliminary configuration of the terminal structure allows the wiring to be shortened while ensuring reliable electrical connection is established before final assembly
2Stability of the object's composition
If external terminals are embedded deep in sealing resin to ensure stable electrical connections, then connection stability is improved, but the wiring length increases
Solution Approach 1:
The terminal structure utilizes the vertical dimension by extending upward from the sealing resin surface rather than only extending horizontally. The lower portion embedded in the resin provides stable connection to the circuit board, while the upper portion projecting above the resin surface allows external connections to be made vertically, thereby reducing the horizontal wiring length while maintaining connection stability through adequate embedding depth
Data Source
AI summary
A semiconductor device includes: an insulated circuit board including an insulating plate and a conductive layer provided on a top surface side of the insulating plate; a semiconductor chip provided on a top surface side of the conductive layer; a sealing resin sealing the semiconductor chip; and an external terminal electrically connected to the semiconductor chip and having a lower portion embedded in the sealing resin and an upper portion projecting above a top surface of the sealing resin.