Embedded Thermal Sensing for Circuit Board Heating Detection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The challenge of undesirable heating in circuit boards due to resistive loading between power and ground layers, which can lead to exothermic events, is not effectively addressed by existing technologies.

Innovation Solution

Embedding temperature sensors within information handling resources to monitor thermal changes on circuit boards, utilizing thermal monitoring systems to detect unexpected heating events by analyzing temperature and operational state information, and taking remedial actions if necessary.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If higher current density is delivered to processors and system loads over limited circuit board space, then power delivery capability is improved, but resistive loading and undesired heating increase

Engineering Contradiction:
Improvepower delivery capabilityVSAvoidresistive loading and heating
Core Design Contradiction:
PowerVSObject-affected harmful factors

Solution Approach 1:

The patent implements preliminary thermal monitoring by embedding temperature sensors in the circuit board before heating events occur. The sensors continuously monitor temperature at critical locations, enabling early detection of resistive loading conditions. This preliminary action allows the system to identify potential heating issues before they escalate into harmful exothermic events, thus enabling high power delivery while mitigating heating risks through early warning capability.

Inventive Principle:
Principle #10Preliminary action

2Difficulty of detecting and measuring

If embedded temperature sensors are added to monitor thermal changes, then detection capability is improved, but device complexity increases

Engineering Contradiction:
Improvethermal change detection capabilityVSAvoidsensor integration complexity
Core Design Contradiction:
Difficulty of detecting and measuringVSDevice complexity

Solution Approach 1:

The patent applies multi-functionality by designing temperature sensors that serve dual purposes: monitoring thermal conditions for safety and providing data for power management optimization. The same sensor infrastructure used for detecting overheating conditions is also utilized for dynamic power adjustment and thermal-aware resource allocation. This universal approach enables improved detection capability without proportionally increasing complexity, as the sensors perform multiple functions within the power management ecosystem.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively detects and mitigates undesirable heating events on circuit boards, minimizing hardware requirements and costs by leveraging existing temperature sensors for monitoring purposes.

Implementation Method 1

an embedded temperature sensor... to monitor thermal change on circuit board

Methodology Applied
Scientific EffectThermal sensing: Temperature Gradient

Implementation Method 2

thermal monitoring system configured to receive temperature information from the embedded temperature sensor... determine if an undesired heating event is present

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12625792B2Systems and methods for utilizing embedded thermal sensors of information handling resource to monitor thermal change on circuit board
Publication Date: 2026.05.12 DELL PROD LP
  • US12625792B2 patent drawing
  • US12625792B2 patent drawing

AI summary

An information handling system may include an information handling resource comprising an embedded temperature sensor and a thermal monitoring system configured to receive temperature information from the embedded temperature sensor, receive operational state information for the information handling system, and based on the temperature information and the operational state information, determine if an undesired heating event is present within the information handling resource.