Embedded Thermal Devices for Lithographic Workpiece Uniformity
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Solution Overview
Problem
Advanced lithography processes, such as EUVL and EBDW, face challenges in maintaining thermal uniformity and controlling temperature in vacuum environments, leading to device performance issues due to heat-related distortions and reduced photoresist sensitivity.
Innovation Solution
A system with a workpiece support embedded with thermal devices like heat pipes, Peltier devices, and thermal conduits, controlled by a temperature management system using sensors and predictive models to maintain homogeneous thermal equalization across the workpiece during lithographic processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If advanced lithography processes (EUVL, EBDW) are performed in vacuum environment, then exposure quality is improved, but thermal management capability deteriorates due to absence of convective cooling
Solution Approach 1:
The patent introduces an intermediary thermal management system consisting of a workpiece support with embedded thermal devices (heat pipes, Peltier devices, thermal conduits) that acts as a mediator between the workpiece and the vacuum environment. This intermediary structure provides active thermal control without requiring convective cooling from the vacuum environment, thereby maintaining both exposure quality and thermal management capability.
Solution Approach 2:
The patent replaces the natural convective cooling mechanism (mechanical system involving air or water flow) with an active thermal control system using solid-state thermal devices. The thermal devices embedded in the workpiece support provide controlled heat removal through conduction and phase change mechanisms, substituting the absent convective cooling in vacuum environment.
2Productivity
If lithographic energy exposure is increased to improve processing efficiency, then productivity is improved, but temperature increase and thermal distortion worsen
Solution Approach 1:
The patent implements a feedback control system where temperature sensors monitor the workpiece temperature during lithographic exposure, and the controller adjusts the operation of thermal devices based on measured temperature values. This feedback mechanism allows the system to maintain optimal processing efficiency while actively compensating for temperature increases through real-time thermal adjustment.
Solution Approach 2:
The patent employs predictive modeling to anticipate temperature increases before they occur during lithographic exposure. The controller uses a model to predict temperature at various locations and activates thermal devices in advance or in real-time to prevent excessive temperature rise, thereby maintaining processing efficiency without thermal distortion.
3Productivity
If workpiece temperature is increased to improve processing speed, then productivity is improved, but photoresist sensitivity and device performance worsen
Solution Approach 1:
The patent implements dynamic thermal control where the workpiece temperature is actively adjusted during the lithographic process rather than maintained at a fixed temperature. The thermal devices are controlled to provide real-time temperature modulation, allowing the system to optimize processing speed while maintaining photoresist sensitivity within acceptable ranges through continuous adaptation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains the workpiece temperature within target ranges, reducing thermal non-uniformity and distortions, thereby enhancing device performance and accuracy in lithographic processes.
Implementation Method 1
The plurality of thermal devices, for example, comprise one or more of a heat pipe
Implementation Method 2
The plurality of thermal devices, for example, comprise one or more of a heat pipe, a Peltier device
Implementation Method 3
a thermal conduit configured to pass a cooling fluid therethrough
Data Source
AI summary
A system and method is provided for providing a thermal distribution on a workpiece during a lithographic process. The system provides a source of lithographic energy to workpiece, such as a workpiece having a lithographic film formed thereover. A workpiece support having a plurality of thermal devices embedded therein is configured to support the workpiece concurrent to an exposure of the workpiece to the lithographic energy. A controller individually controls a temperature of each of the plurality of thermal devices, therein controlling a specified temperature distribution across the workpiece associated with the exposure of the workpiece to the lithographic energy. Controlling the temperature of the thermal devices can be based on a model, a measured temperature of the workpiece, and/or a prediction of a temperature at one or more locations on the workpiece.