Embedded Thermal Pipes for Integrated Circuit Heat Dissipation
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Solution Overview
Problem
Conventional integrated circuit packaging techniques face challenges in effectively dissipating heat from multi-chip modules, particularly in high-power density applications, where efficient heat management is crucial for device performance.
Innovation Solution
The integration of thermal pipes made of thermally conductive materials within the dielectric layers of the integrated circuit package, which thermally couple electrical devices with external heat sinks, allowing for effective heat dissipation without interfering with electrical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging techniques are used for multi-chip modules, then device integration is achieved, but heat dissipation capability is insufficient
Solution Approach 1:
The thermal pipe is embedded within the dielectric layers of the package structure, nesting the heat dissipation component inside the existing package architecture. This allows the thermal management system to be integrated without adding external complexity, as the thermal pipe is concealed within the dielectric material layers that already form part of the package structure.
Solution Approach 2:
The invention combines multiple functions into the dielectric layers: electrical insulation, mechanical support, and thermal conduction. By embedding both electrical interconnect layers and thermal pipes within the same dielectric structure, the package achieves integrated electrical and thermal management without requiring separate structural systems.
2Temperature
If thermal pipes are embedded in dielectric layers, then heat dissipation is enhanced, but manufacturing complexity increases
Solution Approach 1:
The thermal pipes are positioned and embedded within the dielectric layers during the package assembly process, before final curing and sealing. This preliminary placement allows for precise positioning of thermal conduction paths while maintaining flexibility in the manufacturing sequence, enabling integration without requiring post-assembly thermal modifications.
Solution Approach 2:
The dielectric layers serve multiple purposes: providing electrical insulation between conductive layers, offering mechanical support for embedded components, and acting as a thermal conduction medium when thermal pipes are embedded within them. This multi-functionality reduces the need for additional specialized components or processes.
3Adaptability or versatility
If multiple interconnect layers are integrated, then device functionality is improved, but heat accumulation increases
Solution Approach 1:
The thermal pipes act as intermediary heat transfer elements embedded within the dielectric layers. They provide dedicated thermal conduction pathways that mediate between the heat-generating electronic components and the external environment, enabling efficient heat removal without interfering with the electrical interconnect functionality of multiple layers.
Solution Approach 2:
The invention addresses heat management by transitioning from planar heat dissipation to three-dimensional thermal conduction. Thermal pipes extend vertically through multiple dielectric layers, creating thermal pathways in the z-dimension that complement the horizontal electrical interconnect layers, thereby managing heat accumulation without limiting device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables enhanced heat dissipation capabilities, ensuring the reliable operation of high-power integrated circuit packages by efficiently transferring heat to external surfaces, thereby maintaining performance and preventing thermal-related failures.
Implementation Method 1
A thermal pipe made of a thermally conductive material is embedded in at least one associated dielectric layer. The thermal pipe thermally couples the electrical device with one or more external surfaces of the integrated circuit package.
Data Source
AI summary
Various apparatus and methods for improving the dissipation of heat from integrated circuit micro-modules are described. One aspect of the invention pertains to an integrated circuit package with one or more thermal pipes. In this aspect, the integrated circuit package includes multiple layers of a cured, planarizing dielectric. An electrical device is embedded within at least one of the dielectric layers. At least one electrically conductive interconnect layer is embedded within one or more of the dielectric layers. A thermal pipe made of a thermally conductive material is embedded in at least one associated dielectric layer. The thermal pipe thermally couples the electrical device with one or more external surfaces of the integrated circuit package. Various methods for forming the integrated circuit package are described.