Embedded Thermoelectric Cooling in Semiconductor Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor fabrication methods for cooling IC packages are not entirely satisfactory, particularly as they rely on external cooling systems and do not effectively address temperature management within the chip, which can lead to adverse effects on dielectric components and vary in heat generation across different components within the package.
Innovation Solution
The integration of thermoelectric-based modules within the IC chip package, including a thermal detector and a heating/cooling device, which utilize the Peltier effect to internally manage temperature by transferring heat between dissimilar semiconductor structures, allowing for targeted cooling and temperature sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external cooling systems are used to cool IC packages, then the operating temperature can be decreased, but the device complexity and reliance on external systems increases
Solution Approach 1:
The thermoelectric cooling module is embedded within the IC package substrate, nesting the cooling function inside the existing package structure. This eliminates the need for external cooling systems while maintaining effective temperature control of the semiconductor devices.
Solution Approach 2:
The IC package becomes self-cooling by integrating the thermoelectric module directly into the package substrate. The cooling system serves itself by using the package's own structure to house and conduct the cooling function, reducing external dependencies.
2Ease of manufacture
If uniform cooling is applied across the IC package, then temperature management is simplified, but the varying heat generation of different components is not effectively addressed
Solution Approach 1:
Multiple thermoelectric cooling elements are distributed across the package substrate, with each element positioned to cool specific high-heat-generation areas. This localized cooling approach matches the thermal profile of different components, providing effective temperature management where needed most.
Solution Approach 2:
The cooling system is divided into multiple independent thermoelectric elements rather than using a single uniform cooling approach. Each element can be independently controlled and positioned to address the specific thermal requirements of different semiconductor devices on the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective internal cooling and temperature management within the IC chip package, reducing the reliance on external cooling systems and mitigating adverse temperature effects on dielectric components, while allowing for efficient heat dissipation and detection of temperature changes.
Implementation Method 1
heating/cooling device, which utilize the Peltier effect to internally manage temperature by transferring heat between dissimilar semiconductor structures
Implementation Method 2
thermal detector and a heating/cooling device, which utilize the Peltier effect
Data Source
AI summary
A method of forming a semiconductor structure including a thermoelectric module embedded in the semiconductor substrate, where the thermoelectric module includes a first semiconductor structure electrically connected to a second semiconductor structure, where a bottom portion of thermoelectric module extends through a thickness of the semiconductor substrate, and where the first semiconductor structure and the second semiconductor structure include dopants of different conductivity types.