Embedded Thermoelectric Testing With On-Chip Resistor and Switches

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Solution Overview

Problem

The testing of integrated circuits with embedded thermoelectric devices is costly and time-consuming due to the need for special equipment and difficulty in achieving accurate thermal coupling, and identifying defective thermocouples among thousands is challenging.

Innovation Solution

Incorporating an embedded resistor heater/thermometer near the thermoelectric device allows for functional testing using conventional final test equipment, enabling accurate resistance measurement and thermal gradient formation, and utilizing switches to test thermocouples individually or in groups.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If special testing equipment is used to test thermoelectric devices, then measurement precision is improved, but device complexity and testing cost increase

Engineering Contradiction:
Improvethermoelectric device testing accuracyVSAvoidtesting equipment complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent introduces an embedded resistor heater as an intermediary element that serves dual purposes: it acts as a temperature sensor through its resistance changes and as a heater to create thermal gradients. This intermediary component enables conventional electrical test equipment to indirectly measure thermal properties of thermoelectric devices without requiring specialized thermal testing equipment.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces mechanical/thermal testing systems with electrical measurement systems. By measuring the resistance of the embedded resistor at different temperatures and using the known temperature coefficient of resistance, the system substitutes complex thermal measurements with simple electrical resistance measurements that can be performed using conventional electrical test equipment.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If external temperature gradient is applied to test thermoelectric device, then functional testing is achieved, but thermal coupling accuracy deteriorates

Engineering Contradiction:
Improvefunctional testing capabilityVSAvoidthermal coupling accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent embeds the resistor heater directly within the integrated circuit substrate, nesting the testing mechanism inside the device itself. This nested configuration ensures perfect thermal coupling between the resistor and the thermoelectric device, eliminating thermal interface issues that plague external heating methods. The resistor is surrounded by the same thermal environment as the thermoelectric device, ensuring accurate temperature sensing.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The embedded resistor serves as an intermediary that directly senses the thermal environment of the thermoelectric device. By placing the resistor in thermal contact with the substrate, it indirectly measures the thermal conditions experienced by the thermoelectric device without requiring external thermal coupling, thus avoiding thermal interface errors.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If entire thermocouple array is tested as a unit, then testing time is reduced, but defect detection precision deteriorates

Engineering Contradiction:
Improvetesting speedVSAvoiddefect detection accuracy
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The patent divides the thermocouple array into multiple independently controllable segments or groups. By using switch matrices, the testing system can selectively activate and test specific segments of the thermocouple array rather than testing all thermocouples simultaneously. This segmentation maintains testing efficiency while enabling precise localization of defective thermocouples to specific segments.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by enabling different testing conditions to be applied to different segments of the thermocouple array. Each segment can be tested independently with optimized parameters, and defects can be localized to specific regions. This approach maintains the efficiency of array testing while improving defect detection precision through localized analysis.

Inventive Principle:
Principle #3Local quality

4Reliability

If many thermocouples are coupled in series and parallel, then device functionality is improved, but difficulty of detecting defects increases

Engineering Contradiction:
Improvethermoelectric device performanceVSAvoiddefect localization complexity
Core Design Contradiction:
ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent segments the large array of thermocouples into smaller groups that can be independently tested using switch matrices. By dividing the thousands of thermocouples into manageable segments, the system maintains the functional benefits of having many thermocouples in series and parallel while reducing defect detection complexity. Defects can be localized to specific segments rather than searching through the entire array.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces switch matrices as intermediary components that enable selective connection and testing of different thermocouple segments. These switches act as mediators between the test equipment and the thermocouple array, allowing the system to isolate and test individual segments or groups of thermocouples, thereby simplifying defect detection in large-scale devices.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces testing costs and time by eliminating the need for special equipment and enhances the detection of defective thermocouples, ensuring high yield and quality in integrated circuit production.

Implementation Method 1

An embedded resistor heater/thermometer is formed in close proximity to the thermoelectric device

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

A method to test an embedded electrical device using conventional electrical final test equipment

Methodology Applied
Scientific EffectTemperature coefficient of resistance: Electrical Resistance

Implementation Method 3

the thermoelectric device is tested using special equipment which may apply a temperature gradient across the integrated circuit chip while an electrical output is monitored

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Data Source

PatentUS12546666B2Apparatus and method to test embedded thermoelectric devices
Publication Date: 2026.02.10 TEXAS INSTRUMENTS INC
  • US12546666B2 patent drawing
  • US12546666B2 patent drawing
  • US12546666B2 patent drawing

AI summary

An integrated circuit containing an embedded resistor in close proximity to an embedded thermoelectric device. An integrated circuit containing an embedded resistor in close proximity to an embedded thermoelectric device composed of thermoelectric elements and at least one switch to disconnect at least one thermoelectric element from the thermoelectric device. Methods for testing embedded thermoelectric devices.