Embedded Thin-Film Battery for High-Temperature IC Packaging
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Solution Overview
Problem
Existing integrated circuit packages lack efficient and heat-tolerant power sources that can withstand high-temperature assembly processes, such as solder reflow, without compromising the functionality of lithium-ion and lithium-free batteries.
Innovation Solution
Incorporating a thin-film battery, specifically lithium-ion or lithium-free, into the integrated circuit package, where the battery is electrically connected and encapsulated with the integrated circuit die, utilizing a substrate like FR-4 or copper foil, allowing for heat tolerance and flexible integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a thin-film battery is integrated into an integrated circuit package, then the power source functionality is improved, but the device complexity increases
Solution Approach 1:
The patent combines the thin-film battery and integrated circuit die into a single encapsulated package, merging the power source and circuit functionality into one integrated unit. This reduces the number of separate components and simplifies the overall system architecture while providing embedded power.
Solution Approach 2:
The thin-film battery is nested within the integrated circuit package encapsulant, with the battery positioned underneath the circuit die. This nesting approach allows the battery to be embedded within the package structure without increasing the external footprint, integrating power functionality into the existing circuit package form factor.
2Ease of manufacture
If the integrated circuit package is heated to high temperatures during solder reflow, then the assembly process is simplified, but the battery functionality deteriorates
Solution Approach 1:
The thin-film battery is fabricated and prepared in advance on its substrate before being integrated with the circuit die. This preliminary preparation ensures the battery is in its optimal state before exposure to high-temperature solder reflow, and the substrate provides pre-established thermal protection during the assembly process.
Solution Approach 2:
The substrate serves as an intermediary between the thin-film battery and the high-temperature solder reflow environment. The substrate material is selected to withstand high temperatures and acts as a protective barrier, shielding the sensitive battery components from direct thermal exposure during the assembly process while still allowing electrical connectivity.
3Adaptability or versatility
If the battery is fabricated on a substrate, then the manufacturing flexibility is improved, but the area occupied increases
Solution Approach 1:
The thin-film battery is fabricated using thin-film deposition techniques on a substrate, creating a flexible and adaptable power source that can be configured in various shapes and sizes. The thin-film structure allows the battery to conform to different package geometries while maintaining electrical functionality, providing manufacturing flexibility without requiring large areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of thin-film batteries as reliable power sources within integrated circuit packages, ensuring operational integrity during high-temperature assembly processes and providing flexible integration options.
Implementation Method 1
an integrated circuit die and a thin-film battery electrically connected to the integrated circuit die
Implementation Method 2
encapsulated with and electrically connected to a thin-film battery
Data Source
AI summary
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.