Embedded Through-Connect Structure for SiC MOSFET Packaging
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Solution Overview
Problem
Existing electronics packaging techniques require numerous discrete pick and place operations for adding external gate resistors and shims, leading to increased fabrication time, yield issues, and costs, especially when packaging power semiconductor switches like SiC MOSFETs, which lack integrated resistors.
Innovation Solution
An electronics package with a prefabricated embedded structure that includes multiple conductive through-connects and resistors, where a pass-through component with an insulating core and conductive body is integrated into the package, allowing for simplified manufacturing and pre-testing of the resistors and shims before integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If discrete pick and place operations are used for adding external gate resistors and shims, then individual components can be precisely positioned, but fabrication time increases and manufacturing cost increases
Solution Approach 1:
The patent combines multiple discrete components (gate resistors and shims) into a single integrated embedded structure. This structure includes multiple through-connects that provide both mechanical support and electrical connectivity, allowing multiple functions to be achieved through one placement operation rather than multiple discrete operations.
Solution Approach 2:
The embedded structure is pre-fabricated with all necessary through-connects, resistors, and shim elements integrated before being placed into the package. This preliminary integration allows for pre-testing of electrical connections and reduces the number of subsequent assembly steps required during final package assembly.
2Manufacturing precision
If discrete pick and place operations are used for adding external gate resistors and shims, then individual components can be precisely positioned, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple discrete components (gate resistors and shims) into a single integrated embedded structure. This structure includes multiple through-connects that provide both mechanical support and electrical connectivity, allowing multiple functions to be achieved through one placement operation rather than multiple discrete operations.
Solution Approach 2:
The embedded structure serves multiple functions simultaneously: it provides mechanical shimming for proper component spacing, establishes electrical connections through multiple through-connects, and incorporates gate resistors for device control. This multi-functionality eliminates the need for separate discrete components and operations for each function.
3Reliability
If multiple discrete components are placed individually, then each component can be tested separately, but the number of pick and place operations increases
Solution Approach 1:
The patent combines multiple discrete components (gate resistors and shims) into a single integrated embedded structure. This structure includes multiple through-connects that provide both mechanical support and electrical connectivity, allowing multiple functions to be achieved through one placement operation rather than multiple discrete operations.
Solution Approach 2:
The embedded structure is pre-fabricated with all necessary through-connects, resistors, and shim elements integrated before being placed into the package. This preliminary integration allows for pre-testing of electrical connections and reduces the number of subsequent assembly steps required during final package assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and time by enabling the placement of multiple through-connects and resistors in a single pick and place operation, improves package yield through pre-testing, and simplifies the manufacturing process by eliminating the need for individual shim placement.
Implementation Method 1
A metallization layer is formed on a second side of the insulating substrate and extends through at least one via in the insulating substrate to electrically couple at least one conductive pad on the top surface of the semiconductor device to the at least one through-hole structure
Data Source
AI summary
An electronics package includes an insulating substrate, a semiconductor device having a top surface coupled to a first side of the insulating substrate, and a pass-through component coupled to the first side of the insulating substrate. The pass-through component includes an insulating core and at least one through-hole structure comprising a conductive body extending through the thickness of the insulating core. A metallization layer is formed on a second side of the insulating substrate and extends through at least one via in the insulating substrate to electrically couple at least one conductive pad on the top surface of the semiconductor device to the at least one through-hole structure. An insulating material surrounds the semiconductor device and the insulating core of the pass-through component.