Embedded Through-Holed Interposer Packaging Substrate
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Solution Overview
Problem
Conventional packaging substrates face issues with thermal stress cracking due to CTE mismatch with semiconductor chips, and they cannot accommodate high circuit density, leading to reduced product yield and reliability, and increased fabrication costs with the use of silicon interposers.
Innovation Solution
A packaging substrate with a through-holed interposer embedded in a molding layer, featuring conductive through holes and a redistribution-layer structure, which reduces thickness and eliminates the need for conductive bumps, thereby addressing the CTE mismatch and fabrication cost issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a silicon interposer is disposed between the packaging substrate and semiconductor chip to overcome physical mismatch, then the matching between packaging substrate and semiconductor chip is improved, but the thickness of the overall structure increases
Solution Approach 1:
The interposer is embedded within the molding layer, nesting the interposer structure inside the existing package substrate volume rather than stacking it externally. This allows the interposer to provide its matching function while occupying minimal additional space, thereby reducing overall thickness compared to conventional stacked interposer structures
Solution Approach 2:
The invention transitions from a planar stacking approach (substrate-interposer-chip) to a three-dimensional embedded structure where the interposer is integrated within the molding layer. This dimensional reorganization allows the interposer to perform its function while minimizing impact on the overall package thickness
2Reliability
If conductive bumps are used to connect the interposer to the packaging substrate, then electrical connection is achieved, but fabrication cost increases
Solution Approach 1:
The invention extracts and eliminates the conductive bump component from the assembly process. Instead of using separate conductive bumps to connect the interposer to the packaging substrate, the design uses direct embedded connections through the molding layer, thereby reducing fabrication steps and costs while maintaining electrical connectivity
Solution Approach 2:
The invention merges the electrical connection function with the structural embedding process. The interposer is directly connected to the packaging substrate through the molding layer without requiring separate conductive bump components, combining multiple functions into a single integrated structure that reduces manufacturing complexity
Data Source
AI summary
A packaging substrate having a through-holed interposer embedded therein and a fabrication method of the packaging substrate are provided, where the packaging substrate includes: a molding layer having opposite first and second surfaces; a through-holed interposer embedded in the molding layer and flush with the second surface; a redistribution-layer structure embedded in the molding layer and disposed on the through-holed interposer and having a plurality of electrode pads exposed from the first surface of the molding layer; and a built-up structure disposed on the second surface of the molding layer and electrically connected to the through-holed interposer.