Embedded Toroid Transformer Packaging Substrate for EMI Containment
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Solution Overview
Problem
Spiral inductors in electronic circuits face limitations in inductance and are susceptible to electromagnetic interference due to poor containment of magnetic fields, while off-chip inductors offer better containment but are costly and have manufacturing challenges.
Innovation Solution
A packaging substrate with an inductor structure comprising conductive materials and pillars arranged to form a solenoid or toroid coil, partially embedded in a non-conductive material, which enhances inductance and reduces electromagnetic interference while being cost-effective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spiral inductors are fabricated on a silicon chip, then they are easy to build and have consistency in performance, but they have lower inductance and are highly susceptible to nearby magnetic fields
Solution Approach 1:
The patent transitions from planar 2D spiral inductor geometry to a 3D立体 structure using multiple conductive layers and pillars, creating a solenoid or toroid configuration that extends in the vertical dimension. This dimensional change enables better magnetic field containment while maintaining manufacturability through standard multi-layer PCB processes.
Solution Approach 2:
The patent uses composite construction combining multiple conductive materials (copper traces, copper pillars) with a non-conductive substrate (PCB material), creating a structured coil assembly that achieves both mechanical stability and electromagnetic performance. The composite approach allows optimization of each material's properties for its specific function.
2Object-affected harmful factors
If off-chip inductors are used with toroidal or solenoidal configuration, then magnetic fields are better contained and EMI is reduced, but they are costly to manufacture
Solution Approach 1:
The patent makes the PCB substrate serve multiple functions: it provides the mechanical support structure, acts as the non-conductive insulation between conductive layers, provides the bonding interface for mounting the integrated circuit, and forms part of the inductor structure itself. This multi-functionality eliminates the need for separate components and reduces manufacturing cost.
Solution Approach 2:
The patent merges the inductor structure with the PCB substrate by embedding the coil within the substrate layers. The conductive traces and pillars are integrated directly into the PCB structure, combining what were previously separate components (inductor and substrate) into a single unified structure that reduces assembly steps and cost.
3Volume of moving object
If inductor structure is embedded in packaging substrate, then space is saved and integration is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the inductor structure into discrete segments: conductive traces on specific layers, conductive pillars at specific positions, and insulating material in between. This segmentation allows each element to be manufactured and positioned independently using standard multi-layer PCB fabrication processes, reducing overall manufacturing complexity despite the integrated 3D structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective inductor with improved inductance and reduced electromagnetic interference, suitable for power and RF applications, with the ability to handle high currents and maintain signal integrity.
Implementation Method 1
the first conductive material, the second conductive material and the conductive pillars are arranged to form a first coil having an inductance
Implementation Method 2
an advantage of certain geometries such as toroids when compared to spiral inductors, is that magnetic fields associated with the circuit operation are more contained, and thus better for EMI and efficiency
Data Source
AI summary
A packaging substrate and a method for mounting an integrated circuit and/or a circuit component is presented. The packaging substrate includes an upper surface for mounting the integrated circuit and/or circuit component; a lower surface opposite to the upper surface, wherein the lower surface is for mounting to a printed circuit board (PCB); a non-conductive material; wherein the non-conductive material is a plastic: an inductor structure at least partially embedded in the non-conductive material; first and second conductive materials, and conductive pillars, arranged to form a first coil and a second coil having an inductance; wherein the first coil and second coil are arranged as a toroid transformer wound in a double helix configuration.