Embedded Toroidal Coil Module for Compact Wiring Board Integration
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Solution Overview
Problem
Existing modules with toroidal coils face challenges in reducing size and height due to the large occupied area and height constraints, especially when considering the positional relationship with other electronic components.
Innovation Solution
A module design where a coil core is embedded in an insulating layer of a wiring board, with a coil electrode wound around it, and electronic components are strategically placed within the coil core's surrounded region to minimize surface area and height, using metallic pins for conductors to increase coil turns and improve coil characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a toroidal coil is mounted on or in a wiring board, then the coil can be integrated into the module, but the occupied area of the wiring board increases
Solution Approach 1:
The patent embeds the coil core within the insulating layer of the wiring board, nesting the coil structure inside the existing board architecture rather than mounting it on the surface. This allows the coil to be integrated into the module while minimizing the occupied area of the wiring board, as the coil occupies space within the board's thickness rather than extending its footprint.
Solution Approach 2:
The patent transitions from surface mounting (2D placement) to embedded mounting (3D integration) by placing the coil core within the insulating layer. This dimensional change allows the coil to be positioned in the vertical dimension (within the board thickness) rather than consuming horizontal space on the board surface, thereby reducing the occupied area.
2Adaptability or versatility
If a toroidal coil is mounted on or in a wiring board, then the coil can be integrated into the module, but the overall height of the module increases
Solution Approach 1:
The coil core is nested within the insulating layer of the wiring board, utilizing the vertical space already allocated for the board's structure. By embedding the coil within the insulating layer rather than stacking it on top of the board, the overall height increase is minimized while achieving coil integration.
3Ease of operation
If electronic components are disposed outside the coil core region, then easier access and mounting are achieved, but the module size increases
Solution Approach 1:
The patent places electronic components within the region surrounded by the coil core, nesting components inside the coil's footprint rather than arranging them outside. This efficient space utilization allows components to be mounted in the central region of the coil, minimizing the overall module surface area while maintaining accessibility through appropriate via and connection design.
Data Source
AI summary
A module includes a wiring board, an insulating layer that is laminated on the bottom surface of the wiring board, a ring-shaped coil core that is embedded in the insulating layer, a coil electrode that is wound around the coil core, electronic components that are disposed in an inner region surrounded by the coil core in the insulating layer, and an electronic component that is mounted on or in the top surface of the wiring board. With this configuration, the areas of main surfaces of the wiring board and main surfaces of the insulating layer are not large, whereas if the electronic components were mounted on or in the top surface of the wiring board, the areas of the main surfaces of the wiring board and the main surfaces of the insulating layer would be large, and a reduction in the size of the module can be facilitated.