Embedded Toroidal Coil Module for Miniaturization and Thermal Management
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Solution Overview
Problem
The miniaturization of modules with high-frequency signals is limited by the physical size of toroidal coils, and heat dissipation within resin-based wiring boards can degrade coil characteristics.
Innovation Solution
A module design with a ring-shaped coil core embedded in an insulating layer, featuring a coil electrode winding around the core and metal heat-dissipating members both inside and outside the core to enhance thermal conductivity and reduce the module's footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a toroidal coil is mounted on a wiring board to prevent noise in high frequency signals, then the coil characteristics are maintained, but the module size increases due to the large mounting area required
Solution Approach 1:
The patent merges the coil core and coil electrode into a single integrated component structure. The coil electrode is formed to wind around the coil core, creating a compact integrated inductor that eliminates the need for separate mounting of the toroidal coil on the wiring board, thereby reducing the module footprint while maintaining coil characteristics
Solution Approach 2:
The patent transitions from a planar mounting configuration to a three-dimensional embedded structure. The coil core is embedded within the wiring board, and the coil electrode winds around it in multiple dimensions, utilizing vertical space rather than only horizontal mounting area, thus achieving miniaturization
2Area of stationary object
If the wiring board is made of resin to reduce size, then the mounting area is reduced, but heat generated from the coil builds up within the resin leading to degradation of coil characteristics
Solution Approach 1:
The patent employs a composite structure where the wiring board consists of a resin base material combined with a heat-dissipating member made of thermally conductive material. This composite construction allows the wiring board to maintain its compact size while the embedded heat-dissipating member conducts heat away from the coil, preventing temperature buildup and degradation of coil characteristics
Solution Approach 2:
The heat-dissipating member acts as an intermediary between the coil (heat source) and the resin wiring board (insulator). This intermediate component facilitates thermal conduction from the coil to the surrounding structure, enabling effective heat dissipation while maintaining the electrical insulation properties of the resin matrix
3Temperature
If metal heat-dissipating members are used to improve heat dissipation, then thermal conductivity increases, but contact with the coil electrode may lead to degradation of coil characteristics due to eddy currents
Solution Approach 1:
The patent introduces an insulating layer as an intermediary between the metal heat-dissipating member and the coil electrode. This insulating layer maintains thermal contact for heat dissipation while providing electrical isolation, thereby preventing eddy current generation in the metal member that would otherwise degrade coil characteristics
Solution Approach 2:
The patent applies different material properties to different regions: the heat-dissipating member uses high thermal conductivity material for heat transfer, while the insulating layer provides electrical isolation. This localized differentiation of material properties allows simultaneous achievement of thermal conduction and electrical insulation functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for miniaturization by eliminating the need for a large mounting area and improves heat dissipation, reducing coil degradation and stress resistance while maintaining high inductance.
Implementation Method 1
the metal has a thermal conductivity higher than that of a material such as ceramic or resin commonly used to form the insulating layer, and thus the presence of the heat-dissipating member made of metal and disposed outside the coil core within the insulating layer improves the dissipation of the heat generated from the coil
Implementation Method 2
A coil electrode that spirally winds around the magnetic core 102 is formed by a plurality of wiring electrode patterns 103
Data Source
AI summary
A module includes an insulating layer, a ring-shaped magnetic core built in the insulating layer, a coil electrode disposed in the insulating layer so as to spirally wind around the magnetic core, and heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer. Building the magnetic core into the insulating layer as described above eliminates the need to provide the principal face of the insulating layer with a large mounting area for mounting a coil formed by the magnetic core and the coil electrode. This allows the area of the principal face of the insulating layer to be reduced to achieve miniaturization of the module. The presence of the heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer improves dissipation of the heat generated from the coil.