Embedded Trace PCB Module Installation with Fine Pitch
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Solution Overview
Problem
Current PCB technologies face challenges in achieving fine pitches required for certain module integration technologies, particularly in high-density interconnect applications, due to limitations in trace/spacing design rules, which hinder the implementation of advanced connectivity solutions like flip chip direct chip attach and SiP.
Innovation Solution
The integration of embedded trace technology with High Density Interconnect (HDI) PCB technologies allows for the fabrication of printed circuit boards with finer trace/spacing capabilities, enabling module installation with pitches as low as 12/12 μm, and simplifies the supply chain by combining direct chip attach and SMT components into a single PCB solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional PCB technologies are used, then manufacturing cost is reduced and ease of manufacture is improved, but manufacturing precision and trace/spacing capability deteriorate, preventing achievement of fine pitches required for advanced module integration
Solution Approach 1:
The PCB manufacturing process is segmented into multiple stages: conventional PCB fabrication, embedding conductive traces in recesses before final lamination, and selective removal of recesses. This segmentation allows fine-pitch traces to be created in controlled environments while maintaining overall manufacturing feasibility
Solution Approach 2:
Conductive traces are nested within recesses embedded in the PCB substrate. The traces are formed inside cavities that are then sealed with dielectric material, creating a nested structure that protects fine-pitch traces while allowing standard PCB manufacturing processes to be used for the outer layers
2Device complexity
If separate silicon packaging and module assembly processes are used, then adaptability to different packaging requirements is improved, but device complexity and supply chain complexity increase
Solution Approach 1:
The patent merges silicon packaging, trace embedding, and module assembly into a single integrated PCB manufacturing process. Conductive traces are embedded directly on the PCB substrate before final module attachment, eliminating separate packaging steps and simplifying the supply chain while maintaining adaptability through design flexibility
3Manufacturing precision
If finer trace/spacing capabilities are implemented, then manufacturing precision for high-density interconnect is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
Conductive traces are formed and embedded in recesses before final PCB lamination and module assembly. This preliminary action allows fine-pitch traces to be created when the substrate is more accessible, before final positioning constraints are applied, making the overall process simpler despite the precision requirements
Data Source
AI summary
Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.