Embedded Transformer Isolation Barriers for Compact Magnetic Components
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Solution Overview
Problem
Existing embedded magnetic component devices face challenges in achieving high isolation performance due to limited spacing between primary and secondary windings, which is affected by air gaps and contamination, leading to size constraints and safety certification issues.
Innovation Solution
The device incorporates a magnetic core with an air gap and uses resin-based isolation barriers on both sides of the substrate to create a solid bonded joint, reducing the spacing between windings to 0.4 mm, enhancing insulation and preventing arcing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air gaps are present between the cavity and magnetic core, then the device structure is simpler, but isolation performance deteriorates due to arcing and contamination
Solution Approach 1:
The patent introduces resin material as an intermediary substance filling the air gaps between the cavity and magnetic core. This resin mediator eliminates the harmful air gaps while maintaining the simple cavity structure, thereby improving isolation performance without significantly complicating the manufacturing process
Solution Approach 2:
The patent changes the physical state and composition of the gap-filling material from air (gas phase) to resin (solid/liquid phase). This parameter change transforms the gap from a harmful air-filled space into a beneficial resin-filled space that provides electrical insulation and prevents arcing
2Reliability
If spacing between primary and secondary windings is increased, then isolation performance improves, but device size increases
Solution Approach 1:
The patent changes the dielectric material parameter from air to resin, which has superior insulating properties. This allows the winding spacing to be reduced from conventional larger distances to as small as 0.4mm while maintaining or improving isolation performance, thereby reducing device size
Solution Approach 2:
The patent uses resin material as a composite dielectric medium that combines electrical insulation, mechanical bonding, and space-filling properties. This composite approach allows tighter winding spacing while maintaining isolation, achieving compact device size without sacrificing reliability
3Reliability
If epoxy gel is used to fill the cavity, then isolation performance improves, but air bubbles form during solidification causing device failure
Solution Approach 1:
The patent extracts and eliminates the harmful air bubbles from the cavity filling process. By using resin material that can be applied without trapping air, the solution removes the source of the problem (air bubble formation) while maintaining the beneficial isolation performance
Solution Approach 2:
The patent replaces the problematic epoxy gel with resin material that does not require lengthy curing processes or complex degassing. The resin can be applied and set without trapping air bubbles, eliminating the need for additional processing steps and reducing manufacturing complexity
Data Source
AI summary
An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.