Side-by-Side Embedded Transistors for PCB Heat Dissipation
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Solution Overview
Problem
The integration of transistor functions in component carriers, such as printed circuit boards, faces challenges in achieving high thermal performance and compact design while maintaining mechanical robustness and electrical reliability, especially under harsh conditions.
Innovation Solution
A component carrier is designed with a stack of conductive and insulating layers, embedding two transistor components side-by-side at the same vertical level, accompanied by control chips and vias for electrical and thermal connectivity, and incorporating heat removal structures for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If transistor components are arranged side-by-side at the same vertical level in the stack, then thermal performance is improved and compact design is achieved, but manufacturing complexity increases due to precise embedding requirements
Solution Approach 1:
The patent transitions from vertical stacking of transistor components to side-by-side arrangement at the same vertical level, utilizing lateral space within the stack. This dimensional reconfiguration improves thermal performance by enabling better heat dissipation pathways while maintaining compact form factor, and simplifies manufacturing by allowing standard embedding processes to be applied to horizontally arranged components rather than requiring complex vertical alignment.
2Volume of moving object
If transistor components are embedded in the stack, then compact design is achieved, but heat removal becomes more difficult
Solution Approach 1:
The patent implements differentiated thermal management by providing direct thermal access to the transistor components through the component carrier's outer surface while other components remain embedded. The transistor components are positioned with their active surfaces accessible from the exterior, creating localized high-performance heat dissipation zones without compromising the overall compact embedded architecture. This selective exposure enables efficient heat removal from critical components while maintaining the space-saving benefits of embedding.
3Productivity
If multiple electronic components are mounted on the component carrier with smaller spacing, then functionality increases, but heat generation and thermal management issues worsen
Solution Approach 1:
The patent segments the component carrier into distinct functional zones: an first outer surface dedicated to mounting high-density electronic components with accessible transistor components for heat dissipation, and an second outer surface providing alternative mounting options. This spatial segmentation allows high component density on one surface while maintaining thermal management capabilities through dedicated heat dissipation pathways for transistor components, preventing thermal accumulation that would result from uniform high-density packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a flat, compact, and thermally efficient component carrier with improved heat removal, preventing overheating and mechanical stress, and simplifies manufacturing by allowing a single embedding process.
Implementation Method 1
the at least one embedded electronic component is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct comprised of a plurality of vias reaching through at least one of an insulating layer and a conductive layer
Data Source
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AI summary
A component carrier (100) which comprises a stack (102) comprising a plurality of electrically conductive layer structures (104) and/or electrically insulating layer structures (106), and a first transistor component (108) and a second transistor component (110) embedded side-by-side in the stack (102).