Embedded Trench Capacitor Layout for Adjustable Decoupling Capacitance
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Solution Overview
Problem
Existing capacitor designs occupy a relatively large volume of a substrate and capacitance cannot be arbitrarily adjusted after design is fixed.
Innovation Solution
The electronic device incorporates a first electronic component, an encapsulant, and a second capacitor. The encapsulant encapsulates the first electronic component. The first capacitor has a first depth and extends from the upper surface of the encapsulant. The second capacitor has a second depth, and extends from the upper surface of the encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If deep trench capacitors are used to decouple electrical networks, then parasitic inductance is reduced and impedance is reduced, but the capacitor occupies a relatively large volume of the substrate
Solution Approach 1:
The capacitor structure is nested within the substrate by forming capacitor trenches that extend into the substrate volume. The first capacitor trench and second capacitor trench are positioned at different depths, with the first capacitor trench having a greater depth than the second capacitor trench. This nesting approach allows capacitors to be integrated within the substrate rather than occupying additional surface area, thereby reducing the overall device footprint while maintaining the required capacitance values for impedance control.
Solution Approach 2:
The invention transitions from a two-dimensional surface mounting approach to a three-dimensional vertical integration by forming capacitor trenches at different depths within the substrate. The first capacitor extends deeper into the substrate than the second capacitor, utilizing the vertical dimension to accommodate multiple capacitors with different capacitance values. This dimensional change allows for compact integration while maintaining the electrical performance benefits of deep trench capacitors.
2Ease of manufacture
If deep trench capacitors are designed with fixed dimensions, then manufacturing is simplified, but the capacitance cannot be arbitrarily adjusted after design is fixed
Solution Approach 1:
The capacitor system is segmented into multiple discrete capacitor structures (first capacitor and second capacitor) with different trench depths. Each capacitor trench can be independently formed with specific dimensions to achieve the desired capacitance value. This segmentation allows the design to be divided into modular units that can be independently optimized for different capacitance requirements while using standardized manufacturing processes for trench formation.
Solution Approach 2:
The invention utilizes parameter changes by varying the depth of different capacitor trenches to achieve different capacitance values. The first capacitor trench has a greater depth than the second capacitor trench, and this depth parameter variation allows for arbitrary adjustment of capacitance values. By changing the geometric parameters (depth, width, area) of the capacitor trenches during the design phase, the capacitance can be tailored to specific application requirements while maintaining compatibility with standard semiconductor manufacturing processes.
Data Source
AI summary
An electronic device is provided. The electronic device includes a first electronic component, an encapsulant, a first capacitor, and a second capacitor. The encapsulant encapsulates the first electronic component. The first capacitor has a first depth and extends from an upper surface of the encapsulant. The second capacitor has a second depth, different from the first depth, and extends from the upper surface of the encapsulant.