Embedded Ultrafine Circuits in Dielectric Intaglio Patterns
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Solution Overview
Problem
Current circuit board manufacturing techniques face challenges in accurately forming both normal and ultra fine circuits in the same layer due to variability in etching processes, leading to inconsistent line widths and manufacturing limitations.
Innovation Solution
A circuit structure and manufacturing process where a dielectric layer is laser-ablated to form an intaglio pattern, allowing for both normal and ultra fine circuits to be formed using a combination of laser ablating and photolithography and etching processes, with the ultra fine circuits embedded within the intaglio pattern and normal circuits protruding from the surface, using a patterned deposition layer to manage circuit formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional photolithography and etching process is used to form both normal and ultra fine circuits simultaneously, then manufacturing process is simplified, but line width precision and manufacturing quality deteriorate due to etching variability
Solution Approach 1:
The patent divides the circuit formation process into two separate stages: first forming normal circuits using photolithography and etching, then forming ultra fine circuits using laser ablation. This segmentation allows each process to be optimized for its specific circuit type, resolving the contradiction between process simplicity and line width precision.
Solution Approach 2:
The patent performs preliminary laser ablation to create intaglio patterns in the dielectric layer before forming the metal circuits. This preliminary action prepares the substrate to accommodate both normal and ultra fine circuits with different precision requirements, enabling subsequent precise circuit formation without compromising overall manufacturing quality.
2Manufacturing precision
If laser ablation is used to form both normal and ultra fine circuits, then line width precision is improved, but manufacturing time and energy consumption increase
Solution Approach 1:
The patent segments the circuit formation based on size requirements: normal circuits are formed by faster photolithography and etching processes, while only ultra fine circuits require the more time-consuming laser ablation. This segmentation reduces overall manufacturing time while maintaining precision for circuits that require it.
Solution Approach 2:
The patent applies different manufacturing methods to different regions of the circuit board based on local requirements: areas requiring ultra fine circuits undergo laser ablation, while areas with normal circuits use conventional photolithography and etching. This local quality approach optimizes manufacturing time by avoiding unnecessary precision processing in areas where it is not needed.
3Ease of manufacture
If conventional etching process is used for ultra fine circuits, then manufacturing process is simple, but etching variability causes large tolerance in line width
Solution Approach 1:
The patent replaces the chemical etching process with laser ablation for forming ultra fine circuits. This substitution eliminates etching variability and provides precise control over line width, as laser ablation offers better process control and repeatability for fine feature fabrication.
Solution Approach 2:
The patent changes the processing parameters by using laser ablation instead of chemical etching. Laser ablation allows for precise control of energy input, pulse duration, and scanning speed, enabling accurate line width control for ultra fine circuits that cannot be achieved with conventional etching processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise control over circuit line widths and reduces manufacturing time, improving the quality and yield of circuit boards with both embedded ultra fine and non-embedded normal circuits in the same layer.
Implementation Method 1
the surface 22a of the dielectric layer 22 is irradiated by a laser beam L, so as to form a first intaglio pattern 22b and a second intaglio pattern 22c
Data Source
AI summary
A circuit structure of a circuit board includes a dielectric layer, a number of first circuits, and a number of second circuits. The dielectric layer has a surface and an intaglio pattern. The first circuits are disposed on the surface of the dielectric layer. The second circuits are disposed in the intaglio pattern of the dielectric layer. Line widths of the second circuits are smaller than line widths of the first circuits, and a distance between every two of the adjacent second circuits is shorter than a distance between every two of the adjacent first circuits.