Embedded UV Emitter for Opaque Component Bonding
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Solution Overview
Problem
Conventional UV curable substances cannot be effectively cured at bond interfaces between components made of opaque materials, as they cannot be exposed to UV radiation.
Innovation Solution
Incorporating a UV radiation emitting device within the joint interface, which can be powered either through wires or wirelessly by induction, to generate UV radiation and cure the UV curable substance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If UV curable substance is used for bonding components, then curing time is reduced and no additional heating is required, but the substance cannot be cured when located at bond interface between opaque components
Solution Approach 1:
A UV radiation emitting device is introduced as an intermediary element within the bond interface between opaque components. This device generates UV radiation locally at the adhesive location, enabling curing of the UV curable substance despite the opacity of the surrounding components. The emitting device acts as a mediator that bridges the gap between the need for rapid UV curing and the obstruction caused by opaque materials.
Solution Approach 2:
The solution transitions from external UV radiation application to internal UV radiation generation. By embedding the UV radiation emitting device within the bond interface, the curing process moves from a surface-level external application to an internal three-dimensional generation within the adhesive layer, allowing uniform curing throughout the bond line regardless of component opacity.
2Reliability
If conventional adhesives are used, then bonding can be achieved, but curing takes time and requires heating the entire component in an oven
Solution Approach 1:
The patent replaces the thermal curing mechanism (heating) with a photopolymerization mechanism (UV radiation). Instead of using heat to cure the adhesive, a UV radiation emitting device is used to initiate and accelerate the curing process. This substitution eliminates the need for thermal ovens and significantly reduces curing time while maintaining bonding capability.
Solution Approach 2:
The UV radiation emitting device is embedded within the bond interface during assembly, preparing the system in advance for rapid curing. This preliminary placement ensures that UV radiation can be immediately applied to the adhesive when needed, eliminating the time required for heating entire components and enabling on-demand curing at the exact location where bonding is required.
3Productivity
If UV radiation emitting device is embedded in joint interface, then rapid curing is achieved, but device complexity increases
Solution Approach 1:
The UV radiation emitting device is designed to perform multiple functions: it generates UV radiation for curing, can be powered through wires or wirelessly via induction, and enables both bonding and potential separation operations. This multi-functionality reduces the need for separate systems and minimizes overall device complexity despite the added capability of embedded UV generation.
Solution Approach 2:
The patent utilizes different power supply parameters (wired vs. wireless induction) to optimize the emitting device for different application scenarios. By allowing parameter changes in power delivery, the system can adapt to different complexity requirements without fundamentally changing the core UV generation mechanism, thus managing device complexity while maintaining bonding efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid curing of UV curable substances at opaque material interfaces without the need for external heating, allowing for efficient bonding and potential easy separation of bonded components by degrading the cured adhesive.
Implementation Method 1
incorporating a LTV radiation emitting device in the joint interface together with said substance and activating said UV radiation emitting device to generate UV radiation and cure the substance
Implementation Method 2
UV curable substances have the advantage that full cure can be achieved in a rapid manner
Implementation Method 3
the method includes the step of supplying power to said UV emitting device wirelessly by induction
Data Source
AI summary
A method of bonding two components at a joint interface using a UV-curable substance. The method comprises incorporating a UV radiation emitting device in the joint interface between the components together with said substance and supplying power to said UV radiation emitting device to generate UV radiation and cure the substance.