Embedded Lead Via and Protrusion Structure for Compact Semiconductor Packaging
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The semiconductor device design includes a substrate with a lead via and a lead protrusion, where the substrate encapsulant covers the via lateral sides but not the protrusion lateral sides, allowing the lead protrusion to protrude and enhance coupling with external components, along with a redistribution structure for efficient signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and cost is high
Solution Approach 1:
The patent embeds the lead frame structure within the substrate, with the substrate encapsulant covering the via lateral sides. The lead via is nested within the substrate, and the lead protrusion extends from the substrate encapsulant, creating a compact nested configuration that reduces overall package size while maintaining manufacturing feasibility
Solution Approach 2:
The patent transitions from conventional two-dimensional package layouts to a three-dimensional structure by having the lead via extend vertically through the substrate and the lead protrusion extend outward from the substrate encapsulant. This dimensional change enables more efficient space utilization and smaller package footprint
2Reliability
If conventional packages are used, then manufacturing is easier, but reliability is decreased
Solution Approach 1:
The substrate encapsulant is designed to cover specifically the via lateral sides while leaving the protrusion lateral sides exposed. This selective local coverage provides enhanced reliability at the via connections while maintaining manufacturing simplicity through a focused design approach rather than comprehensive complex structures
Solution Approach 2:
The lead structure features asymmetric geometry with the via portion embedded in the substrate and the protrusion portion extending outward. This asymmetric design optimizes both reliability through better mechanical coupling and simplified manufacturing by distinguishing between covered and exposed regions
3Productivity
If conventional packages are used, then manufacturing is simpler, but performance is relatively low
Solution Approach 1:
The substrate encapsulant is formed to cover the via lateral sides before final assembly, pre-establishing reliable electrical and mechanical connections. The lead protrusion is pre-positioned to extend from the encapsulant, enabling efficient subsequent coupling with external components and improving overall device performance
Solution Approach 2:
The substrate acts as an intermediary structure that couples the internal via connections with the external protrusion connections. This intermediary design enables efficient signal and power transmission while maintaining a compact form factor, improving device performance without requiring complex manufacturing processes
Data Source
AI summary
In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate. Other examples and related methods are also disclosed herein.