Embedded Vibration Management System for Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packaging technologies fail to effectively manage vibrations, which can lead to physical damage and thermal stress on integrated circuits, and do not efficiently configure natural resonance frequencies to mitigate vibration-induced stress.
Innovation Solution
An embedded vibration management system is implemented by fabricating a semiconductor package with an array of vibration absorbing structures, comprising mass elements on a lower-density material, placed proximate to a leadframe with two-legged supported leads, to absorb and redirect mechanical energy away from the integrated circuits, thereby dampening vibrations and configuring resonance frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packaging is used, then the package structure is simple and easy to manufacture, but the package cannot effectively manage vibrations and thermal stress
Solution Approach 1:
The packaging structure is divided into distinct functional segments: the leadframe providing electrical connections, the semiconductor device, the encapsulant for protection, and the array of vibration absorbing structures for vibration management. Each segment performs its specific function independently, allowing the complex vibration management capability to be added without compromising the simplicity of other package components.
Solution Approach 2:
The vibration absorbing structures are embedded within the encapsulant material, which itself encases the semiconductor device and leadframe. This nested arrangement integrates the vibration management function into the existing package structure without requiring separate external components, thereby improving reliability while controlling overall structural complexity.
2Object-affected harmful factors
If vibration absorbing structures are added to the package, then vibration intensity is reduced and resonance frequencies are shifted, but the manufacturing process becomes more complex
Solution Approach 1:
The vibration absorbing structures are combined with the encapsulant material in a single integrated component. The encapsulant serves dual functions: protecting the semiconductor device and housing the vibration absorbing structures. This merging reduces the number of separate manufacturing steps and simplifies the overall fabrication process while still providing effective vibration management.
Solution Approach 2:
The encapsulant material is designed to perform multiple functions simultaneously: mechanical protection of the semiconductor device, structural support for the leadframe, and containment for the vibration absorbing structures. This multi-functionality eliminates the need for separate components for each function, thereby maintaining ease of manufacture while addressing vibration-induced stress.
3Stability of the object's composition
If an array of vibration absorbing structures is embedded in the package, then natural resonance frequencies are configured above primary sources of excitation, but the package volume increases
Solution Approach 1:
The vibration absorbing structures are concentrated in specific locations within the encapsulant where they are most effective for managing vibrations from the leadframe and semiconductor device. Rather than uniformly distributing volume-increasing features throughout the entire package, the vibration management functionality is localized to specific regions, minimizing the overall volume increase while achieving the desired resonance frequency configuration.
Solution Approach 2:
The resonance frequencies of the package are controlled by adjusting parameters of the vibration absorbing structures, such as their mass, density, and spatial arrangement, rather than by increasing the overall package volume. By changing these structural parameters, the patent achieves stable resonance frequency configuration above primary excitation sources while maintaining a compact package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces vibration intensity and shifts natural resonance frequencies above primary sources of excitation, enhancing the protection and thermal management of semiconductor packages, particularly in applications like cell phones and motor vehicles.
Implementation Method 1
an array of vibration absorbing structures, comprising mass elements on a lower-density material, placed proximate to a leadframe
Implementation Method 2
to absorb and redirect mechanical energy away from the integrated circuits, thereby dampening vibrations
Implementation Method 3
configuring resonance frequencies
Data Source
AI summary
Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.