Embedded Voltage Regulator in Fan-Out Package for IR Drop Reduction
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Solution Overview
Problem
High-performance computing devices like CPUs and SoCs face challenges with high input/output and power consumption, requiring stable power supply voltages with minimal voltage drop, especially in advanced networking and AI applications where data rates and bandwidth are increasing, and latency is critical.
Innovation Solution
An embedded integrated voltage regulator (IVR) is placed close to the device die in an integrated fan-out package to minimize voltage drop by reducing the physical distance between the voltage regulator and the device, using a redistribution structure to route high voltage signals efficiently and convert them to a regulated voltage output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the voltage regulator is placed far from the device die, then the device complexity is reduced, but the voltage drop increases
Solution Approach 1:
The patent transitions from a planar layout to a three-dimensional stacked architecture, placing the voltage regulator in a different vertical layer ( Redistribution Layer 2) above the device die (Redistribution Layer 1). This vertical separation allows electrical connection through vias while maintaining physical proximity, thereby reducing voltage drop without increasing horizontal package complexity.
Solution Approach 2:
The voltage regulator is embedded within the redistribution structure, with the regulator die nested inside the package substrate. The regulator is surrounded and supported by the redistribution layers and encapsulant material, creating a compact nested configuration that minimizes distance while organizing components efficiently.
2Loss of energy
If the voltage regulator is placed close to the device die, then the voltage drop is reduced, but the device complexity increases
Solution Approach 1:
The patent uses vertical stacking to achieve close proximity between the voltage regulator and device die without increasing lateral footprint. The regulator resides in Redistribution Layer 2 directly above the device die in Redistribution Layer 1, connected via vias, thus minimizing current path length while maintaining compact two-dimensional package dimensions.
Solution Approach 2:
The redistribution structure serves multiple functions simultaneously: it provides electrical interconnection between the voltage regulator and device die, provides mechanical support for the embedded regulator, provides thermal management pathways, and provides physical protection through encapsulation. This multi-functionality reduces the need for additional separate components.
3Ease of manufacture
If the physical distance between voltage regulator and device die is increased, then the ease of manufacture is improved, but the power efficiency deteriorates
Solution Approach 1:
The voltage regulator manufacturing process is merged with the package substrate fabrication process. The regulator die is attached to the redistribution structure during the same manufacturing sequence used to create the package substrate layers, eliminating separate assembly steps and reducing overall manufacturing complexity despite the embedded configuration.
Solution Approach 2:
The redistribution structure with embedded voltage regulator is pre-assembled and tested before final device integration. This preliminary assembly allows quality control and electrical characterization to be performed on the regulator-substrate combination independently, simplifying the final device manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a more consistent and stable voltage output to the device die, reducing IR drop and improving power efficiency, which is essential for high-performance computing applications by ensuring that the voltage regulator is physically closer to the device, thereby minimizing voltage loss.
Implementation Method 1
routing a first voltage signal to the voltage regulator through the second redistribution structure, regulating the first voltage signal to a second voltage signal
Implementation Method 2
The voltage regulator is embedded in the second redistribution structure... routing the second voltage signal to an embedded device die... without routing the second voltage signal through the second redistribution structure
Data Source
AI summary
A method includes attaching a voltage regulator to a first redistribution structure of a first package. A second redistribution structure is formed over the voltage regulator, the voltage regulator being embedded in the second redistribution structure. The first substrate is attached to the second redistribution structure to form a second package including the first package. A first voltage may be provided to the second redistribution structure and through the second redistribution structure to the voltage regulator. The voltage regulator regulates the first voltage into a second voltage and provides the second voltage through the first redistribution structure to a first device die, where an output of the voltage regulator is attached directly to the first redistribution structure.