Embedded Voltage Regulator for IC Power Delivery
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional voltage regulators located on printed circuit boards (PCBs) separate from semiconductor dies result in significant voltage drops, slow response times, and increased die area consumption due to the need for large decoupling capacitors and additional pins, which negatively impact the performance and power efficiency of integrated circuits.
Innovation Solution
A voltage regulator with a passive portion embedded in the packaging substrate and an active portion fabricated on the die, allowing for a shorter, low-inductance path and reduced die area usage, while maintaining quick response times and efficient power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the voltage regulator is located on the PCB separate from the die, then the voltage regulator can be implemented with conventional components, but significant voltage drops occur between the voltage regulator and the die
Solution Approach 1:
The patent merges the voltage regulator with the die by fabricating the regulator circuitry directly on the die using standard CMOS processes. This integration eliminates the separate PCB mounting and shortens the current path, thereby reducing voltage drops while maintaining manufacturability through conventional semiconductor fabrication techniques.
Solution Approach 2:
The patent transitions the voltage regulator from a two-dimensional PCB layout to a three-dimensional integrated structure where the regulator is fabricated within the die itself. This dimensional change places the regulator in immediate proximity to the load, minimizing the current path length and associated voltage drops.
2Ease of manufacture
If the voltage regulator is located on the PCB separate from the die, then the voltage regulator can be implemented with conventional components, but the response time is slow
Solution Approach 1:
The patent merges the voltage regulator with the die by fabricating the regulator circuitry directly on the die using standard CMOS processes. This integration eliminates the separate PCB mounting and shortens the current path, thereby reducing voltage drops while maintaining manufacturability through conventional semiconductor fabrication techniques.
Solution Approach 2:
The patent transitions the voltage regulator from a two-dimensional PCB layout to a three-dimensional integrated structure where the regulator is fabricated within the die itself. This dimensional change places the regulator in immediate proximity to the load, minimizing the current path length and associated voltage drops.
3Adaptability or versatility
If additional pins are added to the die for communication with the voltage regulator, then the die can control voltage scaling, but die area is consumed
Solution Approach 1:
The patent merges the voltage regulator with the die by fabricating the regulator circuitry directly on the die using standard CMOS processes. This integration eliminates the separate PCB mounting and shortens the current path, thereby reducing voltage drops while maintaining manufacturability through conventional semiconductor fabrication techniques.
Solution Approach 2:
The integrated voltage regulator shares the die substrate with the logic circuits, allowing the regulator to serve multiple functions including voltage generation, regulation, and direct integration with existing die structures. This multi-functionality reduces the need for separate dedicated pins and areas.
Data Source
AI summary
A stacked integrated circuit (IC) device includes a semiconductor IC having an active face, and an interconnect structure. The active face receives a regulated voltage from a voltage regulator (MEG). An active portion of the VREG, which supplies the regulated voltage to the semiconductor IC is coupled to the interconnect structure. A packaging substrate includes one or more inductors including a first set of through vias. The first set of through vias are coupled to the interconnect structure and cooperate with the active portion to provide the regulated voltage for the semiconductor IC. The IC also includes a printed circuit board (PCB) coupled to the packaging substrate. The PCB includes a second set of through vias coupled to the first set of through vias. The IC also includes one or more conducting paths on the PCB. The conducting path(s) couple together at least two through vias of the second set of through vias.