Embedded Waterproof Membrane in Multi-Layer Substrate
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Solution Overview
Problem
Existing electronic devices face challenges in maintaining water resistance while allowing air and acoustic wave transmission, as current solutions require additional layers that increase complexity, thickness, and cost.
Innovation Solution
An embedded waterproof and air-permeable membrane is integrated within a multi-layer substrate, reducing the number of layers needed to achieve water resistance and enable air and sound wave transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional layers are added to achieve water resistance, then water protection is improved, but device complexity and thickness increase
Solution Approach 1:
The patent combines the waterproofing function with the existing substrate structure by embedding a waterproof membrane within the substrate layers. This merging approach allows the substrate to serve dual purposes: structural support and water protection, thereby reducing the need for separate additional layers while maintaining water resistance.
Solution Approach 2:
The waterproof membrane is nested within the substrate structure, specifically embedded within the dielectric layers of the multi-layer substrate. This nesting approach integrates the waterproofing function into the existing structural framework, reducing overall device complexity while maintaining protection against liquid penetration.
2Reliability
If additional layers are added to achieve water resistance, then water protection is improved, but device thickness increases
Solution Approach 1:
The patent merges the waterproofing function with the existing substrate layers, allowing the substrate to provide both structural support and water protection. This eliminates the need for separate additional layers that would increase thickness, while maintaining effective water resistance.
Solution Approach 2:
The patent uses a thin waterproof membrane embedded within the substrate to provide water protection. This thin film approach maintains substrate flexibility and minimizes thickness increase, while effectively preventing liquid penetration through the substrate structure.
3Reliability
If additional layers are added to achieve water resistance, then water protection is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the waterproofing function with the existing substrate manufacturing process, allowing both functions to be achieved through a single integrated structure. This merging approach reduces the number of separate components and assembly steps, thereby lowering manufacturing costs while maintaining water protection.
Solution Approach 2:
The substrate structure is designed to serve multiple functions: structural support, electrical insulation, and water protection. This multi-functionality eliminates the need for separate dedicated waterproofing layers, reducing material costs and simplifying the manufacturing process while achieving reliable water protection.
4Reliability
If a waterproof membrane is embedded in the substrate, then water protection is improved, but air flow and acoustic wave transmission may be blocked
Solution Approach 1:
The patent applies local quality by creating specific pathways or openings in the waterproof membrane at strategic locations. These localized modifications allow air flow and acoustic wave transmission through specific regions while maintaining water protection in other areas, thus balancing waterproofing with breathability and sound transmission.
Solution Approach 2:
The patent utilizes porous or permeable materials for the waterproof membrane that allow selective passage of air and acoustic waves while blocking liquids. The porous structure enables gas and sound wave transmission through the membrane while maintaining effective water protection, resolving the contradiction between waterproofing and breathability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thinner, less complex, and cost-effective waterproofing solution for electronic devices, effectively preventing liquid penetration while allowing air and sound waves to reach sensors and microphones.
Implementation Method 1
The vent structure includes an air-permeable membrane to prevent liquid penetration
Implementation Method 2
a vent structure embedded within the substrate to allow air flow through the hole
Data Source
AI summary
An apparatus of the subject technology includes a substrate, including a hole, and a vent structure embedded within the substrate to allow air flow through the hole. The substrate is a multi-layer substrate, and the vent structure includes an air-permeable membrane to prevent liquid penetration.