Embedded Waveguide Adapter in Microelectronic Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency microelectronic assemblies require precise manufacturing processes that are not compatible with conventional semiconductor manufacturing, leading to increased costs and performance challenges.
Innovation Solution
A microelectronic assembly is formed using semiconductor substrates with tuning depressions and radio frequency conductors, allowing for precise electrical characteristics and electromagnetic field direction, while utilizing standard semiconductor processing techniques to minimize costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precise manufacturing processes are used for high-frequency applications, then performance is improved, but manufacturing cost increases and compatibility with conventional semiconductor processes is lost
Solution Approach 1:
The invention divides the package substrate into multiple layers (first substrate layer, second substrate layer, third substrate layer) with distinct functions. The waveguide adapter is embedded within this multi-layer structure, separating the high-precision waveguide interface requirements from the standard semiconductor packaging processes. This segmentation allows different manufacturing approaches for different layers, maintaining performance while improving manufacturability.
Solution Approach 2:
The waveguide adapter acts as an intermediary component that bridges the gap between standard semiconductor packaging and high-frequency waveguide requirements. By embedding this specialized adapter within the multi-layer substrate structure, the invention enables conventional semiconductor manufacturing processes to produce packages that interface with waveguides, thus resolving the compatibility issue without sacrificing performance.
2Reliability
If precise manufacturing processes are used for high-frequency applications, then performance is improved, but compatibility with conventional semiconductor processes deteriorates
Solution Approach 1:
The multi-layer substrate structure segments the manufacturing requirements, allowing standard semiconductor processes to fabricate the majority of the package while specialized processes are only needed for the waveguide adapter portion. This enables the package to be manufactured using conventional semiconductor compatibility while maintaining high-frequency performance.
Solution Approach 2:
The package substrate is designed with multi-functionality, serving both as a standard semiconductor package substrate and as a waveguide interface structure. The embedded waveguide adapter enables the same substrate structure to fulfill both conventional packaging functions and high-frequency waveguide coupling functions, improving adaptability across different application domains.
3Reliability
If waveguide structure is used for high-frequency applications, then electromagnetic coupling performance is improved, but manufacturing precision requirements increase
Solution Approach 1:
The waveguide adapter is embedded within a multi-layer substrate structure, segmenting the precision requirements. The adapter itself handles the critical waveguide interface precision requirements, while the surrounding substrate layers can be manufactured with standard precision tolerances. This segmentation reduces the overall manufacturing precision burden while maintaining electromagnetic coupling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly achieves accurate impedance matching and effective performance in high-frequency applications, such as millimeter wave devices, while maintaining lower manufacturing costs.
Implementation Method 1
A radio frequency conductor is formed on the first opposing side of the first semiconductor substrate. The radio frequency conductor has a first end on the first portion of the first semiconductor substrate and a second end on the second portion of the first semiconductor substrate.
Data Source
AI summary
A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate is provided. The semiconductor substrate has first and second opposing sides and first and second portions. A tuning depression is formed on the second opposing side and the second portion of the semiconductor substrate. A radio frequency conductor is formed on the first opposing side of the first semiconductor substrate. The radio frequency conductor has a first end on the first portion of the first semiconductor substrate and a second end on the second portion of the first semiconductor substrate. A microelectronic die having an integrated circuit formed therein is attached to the first opposing side and the first portion of the semiconductor substrate such that the integrated circuit is electrically connected to the first end of the radio frequency conductor.