Embedded Waveguide Chip Transitions for High-Frequency Signal Loss
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Solution Overview
Problem
Current chip to waveguide transitions suffer from significant signal loss and occupy excessive space, particularly at frequencies above 150 GHz, due to lossy connections through transmission lines on printed circuit boards.
Innovation Solution
A direct chip to waveguide transition is achieved by embedding waveguides within a thinned periphery of a semiconductor chip, using transmitting elements like ring antennas and tapered slot passages for wideband signal transmission, and incorporating a balun to balance signals, allowing simultaneous, low-loss communication with multiple waveguides in a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transmission lines on printed circuit boards are used for chip to waveguide transitions, then signal transmission is enabled, but signal loss increases significantly
Solution Approach 1:
The invention extracts the transmitting element directly from the chip and places it at the waveguide interface, eliminating the intermediate transmission line on the PCB. This direct coupling removes the lossy transmission line from the signal path, thereby reducing signal loss while maintaining transmission capability.
Solution Approach 2:
The patent introduces a specialized transmitting element structure that acts as an intermediary between the chip and waveguide. This mediator enables direct electromagnetic coupling without requiring traditional PCB transmission lines, thus improving signal quality and reducing losses.
2Loss of energy
If flipchip configurations with solder bumps are used, then signal loss is reduced somewhat, but efficiency decreases above 150 GHz
Solution Approach 1:
The invention replaces the mechanical solder bump connection with a direct electromagnetic coupling structure. The transmitting element is positioned to couple directly with the waveguide mode, eliminating the mechanical interface and its associated losses that become problematic at high frequencies above 150 GHz.
3Reliability
If traditional chip to waveguide transitions are used, then signal transmission is achieved, but chip and PCB real estate is significantly occupied
Solution Approach 1:
The invention merges the chip, transmitting element, and waveguide interface into a single integrated structure. The transmitting element is positioned directly on the chip periphery, and the waveguide is coupled directly to this element, eliminating the need for separate PCB transmission line structures and reducing overall footprint.
Solution Approach 2:
The patent transitions from a planar PCB-based transmission approach to a three-dimensional integrated structure where the transmitting element extends from the chip surface directly into the waveguide. This vertical integration reduces the horizontal footprint on both chip and PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces signal loss and minimizes system size, enabling efficient high-frequency communication by allowing direct, simultaneous transmission and reception of signals between a chip and multiple waveguides, while maintaining compatibility with standard semiconductor technologies.
Implementation Method 1
a transmitting element disposed at each of the transition areas, thereby providing one or more simultaneous, direct transitions between the chip and the one or more waveguides
Data Source
AI summary
An apparatus providing a direct chip to waveguide transition, comprising: one or more waveguides, a chip partially embedding each of the waveguides at a transition area positioned at a narrow side of each waveguide, and a transmitting element disposed at each of the transition areas, thereby providing one or more simultaneous, direct transitions between the chip and the waveguides.