Embedded Wire RFID Label Substrate for In-Mould Thermoplastics

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Solution Overview

Problem

Conventional RFID labels using PET substrates are not compatible with In-Mould labeling, leading to higher costs and limited durability, and adhesive-based labels face contamination and adhesion issues during industrial processes.

Innovation Solution

Embedding conductive wire antennas on a special substrate or substrate combination, such as a microporous, dimensionally stable, polyolefin-based material, allows for adhesive-free integration into thermoplastics during the In-Mould process, ensuring durability and compatibility with various thermoplastics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional PET substrates are used for RFID labels, then antenna performance is achieved, but compatibility with In-Mould labeling process is lost

Engineering Contradiction:

ImproveRFID label durabilityVSAvoidCompatibility with In-Mould process

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent changes the substrate material parameters from conventional PET to a specialized polyolefin-based material with specific properties (microporous structure, dimensional stability, high fill content) that enable both RFID functionality and In-Mould process compatibility. This parameter transformation resolves the contradiction by finding a material state that satisfies both requirements.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite substrate structure combining polyolefin base material with microporous architecture and high filler content, creating a multi-phase composite that integrates the mechanical properties needed for In-Mould processing with the electrical properties required for RFID antenna operation.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If etched/printed antennas are used on compatible substrates, then In-Mould compatibility is achieved, but durability and signal strength are reduced

Engineering Contradiction:

ImproveIn-Mould process compatibilityVSAvoidAntenna durability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent replaces the mechanical etching/printing process for antenna creation with an embedded wire antenna system. The wire antenna is physically integrated into the substrate through embedding techniques, eliminating the need for surface etching or printing and providing superior mechanical durability while maintaining In-Mould compatibility.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If adhesive-based labels are used for attachment, then ease of application is improved, but contamination and adhesion reliability are worsened

Engineering Contradiction:

ImproveLabel application simplicityVSAvoidAdhesion reliability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent merges the RFID label substrate with the thermoplastic product through direct integration during the In-Mould process. The label and product become a single integrated component, eliminating the need for separate adhesive attachment and avoiding all associated contamination and adhesion reliability issues.

Inventive Principle:

Principle #5Merging (Combining)

4Ease of manufacture

If conventional substrates are used for In-Mould labeling, then cost is reduced, but compatibility with thermoplastics is limited

Engineering Contradiction:

ImproveManufacturing costVSAvoidCompatibility with thermoplastics

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent develops a universal polyolefin-based substrate that can be integrated with various thermoplastic materials through In-Mould processing. This single substrate type serves multiple functions: providing structural support, enabling RFID operation, and ensuring compatibility with different thermoplastic resins, thereby achieving both cost-effectiveness and broad versatility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a cost-effective, durable, and reliable RFID label that withstands high temperatures, pressures, and industrial processes, maintaining data communication integrity and preventing contamination, while being recyclable and adaptable to various shapes and surfaces.

Implementation Method 1

The antenna receives the signals from an interrogator. Depending on the tag type, it either transmits or reflects the received signal.

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

microporous, dimensionally stable, highly filled, single-layer, polyolefin-based synthetic material (including all grades) is used as the special substrate for RFID IML

Methodology Applied

Scientific EffectAbsorption: Absorption (physical)

Implementation Method 3

one or more conductive wire antennas embedded by ultrasonic, thermal or other process on the special substrate

Methodology Applied

Scientific EffectThermal bonding: Heating

Data Source

PatentUS12585909B2Wire embedded label on special substrate with or without inductive coupling

Publication Date: 2026.03.24 KAPOOR PUNEET

AI summary

In accordance with the embodiments of this disclosure, an RFID label or tag (201, 202, 203, 204) is disclosed. The RFID label or tag (201, 202, 203, 204) includes one or more layers of substrate (1), one or more integrated circuits (2), and one or more antennas (3,3A). Herein, the one or more integrated circuits (2) and the one or more antennas (3,3A) are embedded on the one or more layers of substrate (1).