Embedded Wireless Charging Coil in Semiconductor Package
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Solution Overview
Problem
Current NFC devices face challenges in improving communication quality and reducing package size, particularly for passive RFID devices that require efficient power reception and transmission through antenna structures, which are limited by the strength of magnetic fields and distance from the source.
Innovation Solution
A semiconductor package device is designed with a substrate, package body, conductive layers, dielectric layers, magnetic layers, and coils, where the coil is integrated within the package to enhance power reception and transmission capabilities, utilizing a magnetic resonance wireless charging module that includes a MIM capacitor for efficient current induction and reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a traditional external antenna structure is used for NFC devices, then power reception and transmission can be achieved, but the package size increases and communication quality is limited by magnetic field strength and distance
Solution Approach 1:
The patent merges the antenna function with the package body structure by integrating a coil into the package body. The coil is formed within the package body using conductive layers and dielectric layers, combining the packaging function with the wireless communication function into a single integrated structure, thereby reducing overall size while maintaining communication quality
Solution Approach 2:
The patent transitions from a traditional planar antenna structure to a three-dimensional coil structure embedded within the package body. The coil extends in multiple dimensions within the package body volume, utilizing vertical and horizontal space to create an effective antenna structure that improves power reception while maintaining a compact footprint
2Ease of manufacture
If the coil is integrated within the package body, then overall size is reduced and manufacturing cost decreases, but manufacturing complexity increases due to multiple layers and materials
Solution Approach 1:
The patent segments the antenna structure into multiple functional layers including conductive layers, dielectric layers, and magnetic layers. Each layer has a specific function and can be manufactured using standard semiconductor fabrication processes, allowing complex functionality to be achieved through simple, repeatable manufacturing steps
Solution Approach 2:
The package body structure serves multiple functions: it provides mechanical protection for the semiconductor device, acts as the substrate for the coil structure, and functions as the antenna itself for wireless communication. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of a wireless charging coil within the semiconductor package device reduces overall size and manufacturing costs while improving communication quality and increasing the distance over which NFC devices can operate effectively, with enhanced power reception and transmission efficiency.
Implementation Method 1
utilizing a magnetic resonance wireless charging module that includes a MIM capacitor for efficient current induction
Implementation Method 2
efficient current induction
Implementation Method 3
a MIM capacitor for efficient current induction
Implementation Method 4
A magnetic resonance wireless charging module includes a substrate, a metal-insulator-metal (MIM) capacitor, a magnetic layer and a coil
Data Source
AI summary
A semiconductor device package includes a substrate, a package body, a conductive layer, a dielectric layer, a magnetic layer, a first insulating layer and a coil. The package body is disposed on the substrate. The package body has a first part and a second part disposed above the first part. The conductive layer is disposed on the first part of the package body and is electrically connected to the substrate. The dielectric layer is disposed on the conductive layer. The magnetic layer is disposed on the dielectric layer. The first insulating layer is disposed on the magnetic layer. The coil is disposed on the first insulating layer. The coil has a first terminal electrically connected with the magnetic layer.