Embedded Wireless IC Chip in Multilayer Feeding Substrate
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Solution Overview
Problem
Existing wireless IC devices face issues with unstable operation due to changes in impedance matching states when laminated on articles, mechanical strength, and poor environmental resistance, leading to communication problems and potential damage from external impacts or corrosion.
Innovation Solution
A wireless IC device component featuring a wireless IC chip integrated into a multilayered feeding circuit substrate with a stress alleviating electrode, where the feeding circuit is formed on both sides of the substrate, and includes annular and capacitance elements to maintain impedance matching and enhance mechanical strength, reducing the device's area and height while improving radiation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If matching units are arranged on a dielectric substrate in a plane form, then the wireless tag can be constructed with a simple structure, but the electromagnetic field generated in the matching units extends outside the dielectric substrate, causing changes in dielectric constant, inductance value, and capacitance value when laminated on articles, leading to unstable operation
Solution Approach 1:
The patent transitions from a planar two-dimensional arrangement of matching units on a dielectric substrate to a three-dimensional configuration where matching units are formed within a feeding circuit substrate. This dimensional change allows the electromagnetic field to be contained within the substrate structure, preventing extension outside and eliminating the problem of dielectric constant changes when laminated on articles.
Solution Approach 2:
The patent employs a composite feeding circuit substrate structure that integrates multiple materials with different properties. The substrate combines dielectric materials with conductive patterns to create a structure that maintains stable electrical characteristics. This composite approach allows the matching units to be formed within the substrate while maintaining controlled electromagnetic field distribution and stable impedance matching characteristics.
2Device complexity
If matching units are arranged to the left and right of the IC chip on a dielectric substrate, then the wireless tag can be constructed, but the wireless tag becomes large in size
Solution Approach 1:
The patent utilizes the third dimension by forming matching units within the feeding circuit substrate rather than arranging them in a planar configuration around the IC chip. This allows the matching units to be integrated vertically within the substrate structure, significantly reducing the horizontal area occupied by the wireless tag while maintaining all necessary functional components.
Solution Approach 2:
The patent merges the IC chip, matching units, and feeding circuit into a single integrated feeding circuit substrate structure. By combining these previously separate components into one unified substrate, the overall area of the wireless tag is reduced while maintaining the necessary functionality of each component.
3Ease of operation
If the IC chip is arranged to be viewable externally on a dielectric substrate, then the wireless tag can be constructed, but the IC chip may contact another article when the article is moved or carried, causing damage or detachment due to impact
Solution Approach 1:
The patent relocates the IC chip from an external planar position on the dielectric substrate to an internal position within the feeding circuit substrate. This dimensional relocation embeds the IC chip within the substrate structure, providing mechanical protection against impact and preventing contact with other articles during handling and transport.
Solution Approach 2:
The feeding circuit substrate structure serves as a protective enclosure for the IC chip before any impact occurs. The substrate material and structure are designed to cushion and absorb impact forces, protecting the IC chip from damage during handling and transport operations.
4Device complexity
If the IC chip is exposed to the outside on a dielectric substrate, then the wireless tag can be constructed, but corrosion due to temperature and humidity in the periphery occurs, resulting in poor environment resistance performance
Solution Approach 1:
The patent embeds the IC chip within the feeding circuit substrate, moving it from an exposed external position to an internal protected position. This dimensional change shields the IC chip from environmental factors such as temperature and humidity in the periphery, significantly improving environment resistance performance.
Solution Approach 2:
The feeding circuit substrate acts as a protective shell or enclosure for the IC chip. This substrate structure provides a barrier that protects the IC chip from environmental corrosion caused by temperature and humidity, improving the overall environment resistance of the wireless tag.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and compact wireless IC device with improved mechanical strength and environmental resistance, maintaining desired radiation characteristics and communication stability even when laminated on various articles, while reducing the risk of damage from external stress or corrosion.
Implementation Method 1
a component of a wireless IC device, a wireless IC device according to any one of claims 1 to 6
Implementation Method 2
the feeding circuit includes a matching circuit connected to both terminals of the wireless IC
Implementation Method 3
communication is performed between a reader/writer that generates an induced electromagnetic field and an IC chip
Implementation Method 4
a stress alleviating electrode, wherein the feeding circuit is formed on both sides of the substrate
Implementation Method 5
the feeding circuit includes a matching circuit connected to both terminals of the wireless IC
Implementation Method 6
maintaining desired radiation characteristics and communication stability
Implementation Method 7
improved mechanical strength and environmental resistance, maintaining desired radiation characteristics
Data Source
Figure 1~2
Figure 3~5
Figure 6
AI summary
To provide a small and low-profile component of a wireless IC device and the wireless IC device while increasing the mechanical strength and the environment resistance performance of a wireless IC chip. A component (20A) of a wireless IC device including a wireless IC chip (5) and a feeding circuit substrate (10) on which resin layers are laminated. The wireless IC chip (5) is incorporated inside the feeding circuit substrate (10), and an annular electrode (25) is arranged inside the feeding circuit substrate (10). The component (20A) of a wireless IC device and the radiation plate constitute the wireless IC device.